FI212C245072-T Taiyo Yuden, FI212C245072-T Datasheet - Page 9

FILTER BALANCE BLUETOOTH CSR BC5

FI212C245072-T

Manufacturer Part Number
FI212C245072-T
Description
FILTER BALANCE BLUETOOTH CSR BC5
Manufacturer
Taiyo Yuden
Series
FIr
Datasheet

Specifications of FI212C245072-T

Frequency
2.45GHz Center
Bandwidth
100MHz
Filter Type
Balance
Ripple
1dB
Insertion Loss
3.7dB
Package / Case
0805 (2012 Metric)
Mounting Type
Surface Mount
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
587-2316-2
chipfil_reli-PRP2
【Test Methods and Remarks】
【Test Methods and Remarks】
【Test Methods and Remarks】
【Test Methods and Remarks】
【Test Methods and Remarks】
【Test Methods and Remarks】
【Test Methods and Remarks】
【Test Methods and Remarks】
【Test Methods and Remarks】
Note on standard condition:
* This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
Specified Value
Specified Value
Specified Value
Specified Value
Specified Value
Specified Value
Specified Value
Specified Value
Specified Value
Specified Value
1. Operating Temperature Range
2. Storage Temperature Range
3. Resistance to Flexure of Substrate
4. Adhesion of Electrode
5. Solderability
6. Resistance to Solder Heat
7. Thermal Shock
8. Humidity (steady state)
9. High temperature life test
10. Low temperature life test
※Note : ー20 to +35℃ in taped packaging
Warp
Testing board : Glass epoxy-resin substrate
Thickness
Applied force : 5N
Duration
Solder temperature : 230±5℃
Duration
Preheating
Solder temperature : 260±5℃
Duration
According to JIS C 0025.
Conditions for 1 cycle
Number of cycles : 100
Mounting method : Soldering onto PC board.
Recovery
Temperature : +40±2℃
Humidity
Temperature : +85±2℃
Duration
Temperature : ー40±2℃
Duration
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
RELIABILITY DATA
Step
1
2
3
4
"standard condition" referred to herein is defined as follows :
5 to 35℃ of temperature, 45 to 85% relative humidity and 86 to 106kPa of air pressure.
When there are questions concerning measurement result :
In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity and 86 to 106kPa of air pressure.
Unless otherwise specified, all the tests are conducted under the "standard condition".
: 90~95%RH
: 96 hrs
: 96 hrs
: 2mm
: 0.8mm
: 10 sec.
Room Temperature
Room Temperature
Temperature (℃)
: 2 to 3 hrs of recovery under the standard condition after the removal from test chamber.
ー40±3℃
: 4±1 sec.
: 150℃ for 2 min.
: 5±0.5 sec.
85±2℃
Recovery : 2 to 3 hrs of recovery under the standard condition after the removal from test chamber.
Duration : 96 hrs
Recovery : 2 to 3 hrs of recovery under the standard condition after the removal from test chamber.
Recovery : 2 to 3 hrs of recovery under the standard condition after the removal from test chamber.
Preconditioning
Immersion and Removal speed : 25mm/sec.
Duration (min)
Preconditioning
Immersion and Removal speed : 25mm/sec.
Recovery
Within 3
Within 3
30±3
30±3
-30~+85℃
-30~+85℃
No mechanical damage.
Characteristics : shall satisfy the electrical characteristics.
Appearance
75% or more of immersed surface of terminal electrode shall be covered with fresh solder.
Characteristics : shall satisfy the electrical characteristics.
Appearance
Characteristics : shall satisfy the electrical characteristics.
Appearance
Characteristics : shall satisfy the electrical characteristics.
Appearance
Characteristics : shall satisfy the electrical characteristics.
Appearance
Characteristics : shall satisfy the electrical characteristics.
Appearance
: Immersion into flux.
: No significant abnormality.
: No significant abnormality.
: No significant abnormality.
: No significant abnormality.
: No significant abnormality.
: No significant abnormality.
: Immersion into flux.
: 2 to 3 hrs of recovery under the standard condition after the removal from test chamber.
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chipfil_reli_e-01

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