AD9484BCPZ-500 Analog Devices Inc, AD9484BCPZ-500 Datasheet - Page 7

• Manufacturer Part Number: AD9484BCPZ-500
• Description: IC ADC 8BIT 500MSPS 56LFCSP
• Manufacturer: Analog Devices Inc

Specifications of AD9484BCPZ-500

• Sampling Rate: 500MSPS
• Input Channel Type: Differential, Single Ended
• Data Interface: Serial, SPI
• Supply Current: 283mA
• Digital Ic Case Style: LFCSP
• No. Of Pins: 56
• Operating Temperature Range: -40°C To +85°C
• Rohs Compliant: Yes
• Resolution (bits): 8bit
• Number Of Elements: 1
• Resolution: 8Bit
• Architecture: Pipelined
• Input Type: Voltage
• Differential Input: Yes
• Power Supply Requirement: Single
• Single Supply Voltage (typ): 1.8V
• Single Supply Voltage (max): 1.9V
• Dual Supply Voltage (typ): Not RequiredV
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Power Dissipation: 720mW
• Differential Linearity Error: ±0.25LSB
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 56
• Package Type: LFCSP EP
• Input Signal Type: Differential
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Electrical
Environmental
AVDD to AGND
DRVDD to DRGND
AGND to DRGND
AVDD to DRVDD
D0+/D0− through D7+/D7−
DCO+, DCO− to DRGND
OR+, OR− to DRGND
CLK+ to AGND
CLK− to AGND
VIN+ to AGND
VIN− to AGND
SDIO/DCS to DRGND
PDWN to AGND
CSB to AGND
SCLK/DFS to AGND
CML to AGND
VREF to AGND
Storage Temperature Range
Operating Temperature Range
Lead Temperature
Junction Temperature
(Soldering, 10 sec)
to DRGND
Rating
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +0.3 V
−2.0 V to +2.0 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−65°C to +125°C
−40°C to +85°C
300°C
150°C
Rev. 0 | Page 7 of 24
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the PCB
increases the reliability of the solder joints, maximizing the
thermal capability of the package.
Table 6.
Package Type
56-Lead LFCSP_VQ (CP-56-5)
Typical θ
Airflow increases heat dissipation, effectively reducing θ
addition, metal in direct contact with the package leads from
metal traces, through holes, ground, and power planes reduces
the θ
ESD CAUTION
JA
.
JA
and θ
JC
are specified for a 4-layer board in still air.
θ
23.7
JA
θ
1.7
JC
AD9484
Unit
°C/W
JA
. In