ML610Q407-NNNTBZ03A7 Rohm Semiconductor, ML610Q407-NNNTBZ03A7 Datasheet - Page 10

• Manufacturer Part Number: ML610Q407-NNNTBZ03A7
• Description: MCU 8BIT 16K FLASH 12CH 100-TQFP
• Manufacturer: Rohm Semiconductor
• Series: -r

Specifications of ML610Q407-NNNTBZ03A7

• Core Processor: nX-U8/100
• Core Size: 8-Bit
• Speed: 2MHz
• Connectivity: SSP, UART/USART
• Peripherals: LCD, Melody Driver, POR, PWM, WDT
• Number Of I /o: 22
• Program Memory Size: 16KB (8K x 16)
• Program Memory Type: FLASH
• Eeprom Size: -
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 1.25 V ~ 3.6 V
• Data Converters: A/D 2x16b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 70°C
• Package / Case: 100-TFQFP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

OKI SEMICONDUCTOR
ML610Q409 Chip Pin Layout & Dimension
Note:
The assignment of the pads P30 to P35 are not in order.
P20
P21
P22
P24
P00
P02
P03
P04
P30
P31
P34
P32
P33
P35
P57
P56
P55
P54
P53
P01
V
V
SS
PP
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
Figure 7 ML610Q409 Chip Layout & Dimension
Chip size: 2.27 mm × 2.23 mm
PAD count: 88 pins
Minimum PAD pitch: 80 μm
PAD aperture: 70 μm×70 μm
Chip thickness: 350 μm
Voltage of the rear side of chip: V
2.27mm
ML610Q407/ML610Q408/ML610Q409
SS
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
level.
SEG17
SEG16
SEG15
SEG14
SEG13
SEG12
SEG11
SEG10
SEG9
SEG8
SEG7
SEG6
SEG5
SEG4
SEG3
COM4/SEG2
COM3/SEG1
COM2/SEG0
COM1
COM0
C2
C1
Y
2.23mm
X
FEDL610Q409-01
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