SY58032UMG Micrel Inc, SY58032UMG Datasheet - Page 9

• Manufacturer Part Number: SY58032UMG
• Description: IC BUFFER 1:8FANOUT LVPECL 32MLF
• Manufacturer: Micrel Inc
• Series: Precision Edge®r
• Type: Fanout Buffer (Distribution)r

Specifications of SY58032UMG

• Number Of Circuits: 1
• Ratio - Input:output: 1:8
• Differential - Input:output: Yes/Yes
• Input: CML, LVDS, LVPECL
• Output: LVPECL
• Frequency - Max: 4GHz
• Voltage - Supply: 2.375 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-MLF®, QFN
• Frequency-max: 4GHz
• Number Of Outputs: 16
• Operating Supply Voltage (max): 3.6V
• Operating Temp Range: -40C to 85C
• Propagation Delay Time: 0.33ns
• Operating Supply Voltage (min): 2.375V
• Mounting: Surface Mount
• Pin Count: 32
• Operating Supply Voltage (typ): 2.5/3.3V
• Package Type: MLF
• Input Frequency: 4GHz
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 576-1389

Micrel, Inc.
M9999-072810
[e-mail] or [phone]
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can
The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use.
reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into
the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s
use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchaser’s own risk and Purchaser agrees to fully indemnify
32-PIN MicroLeadFrame
Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
Package Notes:
1. Package meets Level 2 qualification.
2. All parts are dry-packaged before shipment.
3. Exposed pads must be soldered to a ground for proper thermal management.
tel
+ 1 [phone]
®
(MLF-32)
(Always solder, or equivalent, the exposed pad to the PCB)
PCB Thermal Consideration for 32-Pin MLF
Heat Dissipation
Micrel for any damages resulting from such use or sale.
fax
© 2005 Micrel, Incorporated.
+ 1 [phone]
9
CompSide Island
Heat Dissipation
Heavy Copper Plane
Heavy Copper Plane
web
http://www.micrel.com
Package
EP- Exposed Pad
Die
®
Package
V
V
EE
EE
Precision Edge
SY58032U
®