IDT85304-01PGG IDT, Integrated Device Technology Inc, IDT85304-01PGG Datasheet - Page 9
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IDT85304-01PGG
Manufacturer Part Number
IDT85304-01PGG
Description
IC CLK FAN BUFF MUX 1:5 20TSSOP
Manufacturer
IDT, Integrated Device Technology Inc
Type
Fanout Buffer (Distribution), Multiplexerr
Datasheet
1.IDT85304-01PGGI.pdf
(11 pages)
Specifications of IDT85304-01PGG
Number Of Circuits
1
Ratio - Input:output
1:5
Differential - Input:output
Yes/Yes
Input
CML, HCSL, LVDS, LVHSTL, LVPECL, SSTL
Output
LVPECL
Frequency - Max
650MHz
Voltage - Supply
3.135 V ~ 3.465 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
20-TSSOP
Frequency-max
650MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
85304-01PGG
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
IDT85304-01PGGI
Manufacturer:
Cypress
Quantity:
225
POWER DISSIPATION:
for the V
power dissipated in the load.
JUNCTION TEMPERATURE:
recommended junction temperature for this device is 125°C.
linear feet per minute and a multi-layer board, the appropriate value is 77.6°C/W per the following Thermal Resistance table. Therefore, t
temperature of 85°C with all its outputs switching is:
layer or multi-layer).
THERMAL RESISTANCE
θ
POWER CONSIDERATIONS
IDT85304-01
LOW SKEW, 1-TO-5 DIFFERENTIAL-TO-3.3V LVPECL
JA
This section provides information on power dissipation and junction temperature for the IDT85304-01. Equations and example calculations are also provided.
The total power dissipation for the IDT85304-01is the sum of the core power plus the power dissipated in the load(s). The following is the power dissipation
Power (core)
Power (outputs)
If all outputs are loaded, the total power is 5 * 30.2mW = 151mW
Total Power_
Junction temperature (t
The equation for is as follows: t
t
θ
Pd_total = Total Device Power Dissipation (example calculation is in Power Dissipation, above)
T
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance (θ
85°C + 0.341W * 77.6°C/W = 111.5°C. This is well below the limit of 125°C.
This calculation is only an example. t
J
JA
A
for 20-pin TSSOP, forced convection
= Junction Temperature
Multi-Layer PCB, JEDEC Standard Test boards
= Ambient Temperature
= Junction-to-Ambient Thermal Resistance
DD
= 3.3V + 5% = 3.465V, which gives worst case results. Please refer to the following section, Calculations and Equations, for details on calculating
MAX
MAX
MAX
= V
(3.465V, with all outputs switching) = 190.57mW + 151mW = 341.57mW
= 30.2mW/Loaded Output Pair
DD
_
J
MAX
) is the temperature at the junction of the bond wire and bond pad. It directly affects the reliability of the device. The maximum
* I
EE
J
= θ
_
MAX
JA
J
will obviously vary depending on the number of loaded outputs, supply voltage, air flow, and the type of board (single-
* Pd_total + T
= 3.465 * 55mA = 190.57mW
A
θ θ θ θ θ
JA
by Velocity (Linear Feet per mInute)
9
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
92.6
0
JA
) must be used. Assuming a moderate air flow of 200
77.6
200
70.9
400
J
for an ambient
°C/W
Unit