09 47 474 7201 HARTING, 09 47 474 7201 Datasheet - Page 123

• Manufacturer Part Number: 09 47 474 7201
• Description: Ha-Vis Smart Patch Cable CAT.6 Yel. 1m
• Manufacturer: HARTING

Specifications of 09 47 474 7201

• Rohs Compliant: Yes

SMC connectors
SMC (Surface Mount Compatible) connectors have to
withstand temperatures of up to 225°C in the reflow
oven for 10 to 15 seconds. Therefore, the moulding
must be made from a dimensionally stable plastic
which expands at the same rate as the pcb material
when subjected to heat.
The length of the connector contacts should be such
that they protrude by no more than 1.5 millimetres
after insertion to the pcb. Each contact collects solder
on its tip as it penetrates the solder paste in the hole.
So if the contact was too long, this solder would no
longer be able to reflow back into the plated through
hole by capillary action during the soldering process,
therefore the quality of the soldered connection would
suffer as a result.
Connector design must permit both automatic
assembly with pick-and-place machines and manual
positioning for test and pre-production batches. It is
also important for the packaging of the connectors
to be suitable for automated assembly. Experience
shows that deep-drawn film and reel packaging fed
into the pick-and-place machines with the aid of a
conveyor system is particularly suitable.
Bellows for SMC
HARTING SMC technology
HARTING offers its customers a complete system
concept for integrating SMC technology into existing
production lines. We manufacture a wide range of
SMC connectors (3 and 5 row) in compliance with
IEC 60 603-2, D-Sub connectors in compliance with
CECC 75 301-802 and connectors from the har-mik
series with contact spacing of 1.27 millimetres. In
addition, HARTING supports the market with packaging
and processing concepts, which have been developed
in collaboration with renowned manufacturers of SMC
soldering and assembly plants.
SEK connector mounted in a tape ready for placement using an
odd form assembly station.
Advantages of the “Pin in Hole Intrusive
Reflow” process:
• Partial dip soldering or press-in is no longer
• Complete compatibility with Surface Mount
• Complete integration into the automated
• Reduced floor space in the production plant
• As a rule, no additional investment costs
required
Technology
assembly process
General information
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