NB2669ASNR2 ON Semiconductor, NB2669ASNR2 Datasheet - Page 8

• Manufacturer Part Number: NB2669ASNR2
• Description: IC CLOCK SYNTHESIZR 4MA TSOT-6
• Manufacturer: ON Semiconductor
• Type: Clock/Frequency Synthesizerr

Specifications of NB2669ASNR2

• Pll: Yes
• Input: CMOS
• Output: CMOS
• Number Of Circuits: 1
• Ratio - Input:output: 1:1
• Differential - Input:output: No/No
• Frequency - Max: 13MHz
• Divider/multiplier: Yes/No
• Voltage - Supply: 2.375 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: SC-74-6
• Frequency-max: 13MHz
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent
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0.05
NOTE 5
E1
A1
e
1
6
2
5
D
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
3
4
b
E
A
*For additional information on our Pb--Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
c
DETAIL Z
L
N. American Technical Support: 800--282--9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
DETAIL Z
SOLDERING FOOTPRINT*
H
USA/Canada
Phone: [phone]
Phone: [phone]
3.20
M
http://onsemi.com
RECOMMENDED
CASE 318G--02
L2
C
GAUGE
PLANE
ISSUE U
TSOP- -6
PLANE
SEATING
DIMENSIONS: MILLIMETERS
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.
0.95
PITCH
LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D
AND E1 ARE DETERMINED AT DATUM H.
0.60
6X
0.95
6X
DIM
A1
E1
L2
A
D
M
b
c
E
e
L
0.90
0.01
0.25
0.10
2.90
2.50
1.30
0.85
0.20
MIN
0
MILLIMETERS
0.25 BSC
NOM
1.00
0.06
0.38
0.18
3.00
2.75
1.50
0.95
0.40
--
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MAX
1.10
0.10
0.50
0.26
3.10
3.00
1.70
1.05
0.60
10
NB2669A/D