PCF2123TS/1,112 NXP Semiconductors, PCF2123TS/1,112 Datasheet - Page 52

• Manufacturer Part Number: PCF2123TS/1,112
• Description: IC SPI RTC/CALENDAR 14-TSSOP
• Manufacturer: NXP Semiconductors
• Type: Clock/Calendar/Alarmr

Specifications of PCF2123TS/1,112

• Package / Case: 14-TSSOP
• Time Format: HH:MM:SS (12/24 hr)
• Date Format: YY-MM-DD-dd
• Interface: SPI, 3-Wire Serial
• Voltage - Supply: 1.1 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Function: Clock, Calendar
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.1 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Rtc Bus Interface: Serial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Memory Size: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935286384112; PCF2123TS/1; PCF2123TS/1

NXP Semiconductors
16. Handling information
17. Packing information
PCF2123
Product data sheet
Fig 36. PCF2123Ux wafer information
1.449 mm
(1) Die marking code.
Seal ring plus gap to active circuit ~18 m.
1
1
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling Metal-Oxide Semiconductor (MOS) devices ensure that
all normal precautions are taken as described in JESD625-A, IEC 61340-5 or equivalent
standards.
Table 49.
[1]
Type number
PCF2123U/12HA/1
PCF2123U/10AA/1
PCF2123U/12AA/1
1.492 mm
Wafer mapping information will be distributed to customer’s ftp server.
X
straight edge
of the wafer
PCF2123Ux wafer information
(1)
All information provided in this document is subject to legal disclaimers.
1
1
Rev. 4 — 22 December 2010
Wafer thickness
200
200
150
45 μm
6 inch
6 inch
6 inch
Wafer diameter
SPI Real time clock/calendar
Saw lane
detail X
~18 μm
Marking of bad die
inking
wafer mapping
inking
70 μm
PCF2123
© NXP B.V. 2010. All rights reserved.
013aaa232
[1]
~18 μm
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