PCF8583T/5,518 NXP Semiconductors, PCF8583T/5,518 Datasheet
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PCF8583T/5,518
Specifications of PCF8583T/5,518
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PCF8583TD-T
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PCF8583T/5,518 Summary of contents
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PCF8583 Clock and calendar with 240 x 8-bit RAM Rev. 06 — 6 October 2010 1. General description The PCF8583 is a clock and calendar chip, based on a 2048 bit static CMOS organized as 256 words by 8 bits. ...
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... NXP Semiconductors 3. Ordering information Table 1. Type number PCF8583P PCF8583T PCF8583BS 4. Marking Table 2. Type number PCF8583P PCF8583T PCF8583BS 5. Block diagram OSCI OSCO INT SCL SDA Fig 1. PCF8583 Product data sheet Ordering information Package Name Description DIP8 plastic dual in-line package; 8 leads (300 mil) SO8 plastic small outline package ...
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... NXP Semiconductors 6. Pinning information 6.1 Pinning Fig 2. Fig 3. Fig 4. PCF8583 Product data sheet OSCI 1 2 OSCO Top view. For mechanical details, see Pin configuration for DIP8 (PCF8583P) 1 OSCI OSCO Top view. For mechanical details, see Pin configuration for SO8 (PCF8583T) terminal 1 index area n ...
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... NXP Semiconductors 6.2 Pin description Table 3. Pin description Symbol Pin DIP8 SO8 (PCF8583P) (PCF8583T) OSCI 1 1 OSCO SDA 5 5 SCL 6 6 INT n. [1] The die paddle (exposed pad) is connected to V PCF8583 Product data sheet Type HVQFN20 (PCF8583BS) 2 input 3 output 4 input [1] 5 supply ...
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... NXP Semiconductors 7. Functional description The PCF8583 contains a 256 by 8 bit RAM with an 8 bit auto-increment address register, an on-chip 32.768 kHz oscillator circuit, a frequency divider, a serial two-line bidirectional 2 I C-bus interface, and a Power-On Reset (POR) circuit. The first 16 bytes of the RAM (memory addresses 00h to 0Fh) are designed as addressable 8 bit parallel special function registers ...
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... NXP Semiconductors 7.3 Control and status register The control and status register is defined as the memory location 00h with free access for reading and writing via the I contents of the control and status register (see Fig 5. PCF8583 Product data sheet 2 C-bus. All functions and options are controlled by the ...
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... NXP Semiconductors 7.4 Counter registers The format for 24 hour or 12 hour clock modes can be selected by setting the most significant bit of the hours counter register. The format of the hours counter is shown in Figure 6. MSB 7 013aaa371 Fig 6. The year and date are stored in memory location 05h (see months are in memory location 06h (see Fig 7 ...
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... NXP Semiconductors In the different modes the counter registers are programmed and arranged as shown in Figure 9. Counter cycles are listed in Fig 9. PCF8583 Product data sheet Table control/status hundredth of a second 1/10 s 1/100 s seconds minutes 10 min 1 min hours year/date 10 day 1 day weekdays/months 10 month 1 month ...
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... NXP Semiconductors Table 4. Unit hundredths of a second seconds minutes hours (24) hours (12) date months year weekdays timer 7.5 Alarm control register When the alarm enable bit of the control and status register is set (address 00h, bit 2) the alarm control register (address 08h) is activated. All alarm, timer, and interrupt output ...
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... NXP Semiconductors Fig 10. Alarm control registers, clock mode 7.6 Alarm registers All alarm registers are allocated with a constant address offset of 08h to the corresponding counter registers (see An alarm signal is generated when the contents of the alarm registers match bit-by-bit the contents of the involved counter registers. The year and weekday bits are ignored in a dated alarm ...
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... NXP Semiconductors Fig 11. Selection of alarm weekdays 7.7 Timer The timer (location 07h) is enabled by setting the control and status register to XX0X X1XX. The timer counts up from 0 (or a programmed value) to 99. On overflow, the timer resets to 0. The timer flag (LSB of control and status register) is set on overflow of the timer ...
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... NXP Semiconductors CONTROL/STATUS REGISTER (1) (1) If the alarm enable bit of the control and status register is reset (logic 0 signal is observed on the interrupt pin INT. Fig 12. Alarm and timer interrupt logic diagram 7.8 Event counter mode Event counter mode is selected by bits 4 and 5 which are logic 10 in the control and status register ...
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... NXP Semiconductors this mode, the timer (location 07h) increments once for every one, one hundred, ten thousand million events, depending on the value programmed in bits 0, 1 and 2 of the alarm control register. In all other events, the timer functions are as in the clock mode. ...
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... NXP Semiconductors In the 50 Hz clock mode or event-counter mode the oscillator is disabled and the oscillator input is switched to a high-impedance state. This allows the user to feed the 50 Hz reference frequency or an external high speed event signal into the input OSCI. 7.11 Initialization When power-on occurs the I counters are reset ...
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... NXP Semiconductors 8. Characteristics of the I 8.1 Characteristics 2 The I C-bus is for bidirectional, two-line communication between different ICs or modules. The two lines are a Serial DAta line (SDA) and a Serial Clock Line (SCL). Both lines must be connected to a positive supply via a pull-up resistor. Data transfer is initiated only when the bus is not busy ...
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... NXP Semiconductors SDA SCL MASTER TRANSMITTER RECEIVER Fig 16. System configuration 8.1.4 Acknowledge The number of data bytes transferred between the START and STOP conditions from transmitter to receiver is unlimited. Each byte of eight bits is followed by an acknowledge cycle. • A slave receiver, which is addressed, must generate an acknowledge after the reception of each byte. • ...
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... NXP Semiconductors 2 8.2 I C-bus protocol 8.2.1 Addressing Before any data is transmitted on the I addressed first. The addressing is always carried out with the first byte transmitted after the start procedure. The clock and calendar acts as a slave receiver or slave transmitter. The clock signal SCL is only an input signal but the data signal SDA is a bidirectional line ...
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... NXP Semiconductors acknowledgement from slave SLAVE ADDRESS R/W (1) At this moment master transmitter becomes master receiver and PCF8583 slave receiver becomes slave transmitter. Fig 19. Master reads after setting word address (write word address; READ data) Fig 20. Master reads slave immediately after first byte (READ mode) ...
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... NXP Semiconductors 9. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol tot ESD stg T amb [1] Pass level; Human Body Model (HBM), according to [2] Pass level; Machine Model (MM), according to [3] Pass level; latch-up testing according to [4] According to the NXP store and transport requirements (see stored at a temperature of +8 ° ...
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... NXP Semiconductors 10. Characteristics 10.1 Static characteristics Table 7. Static characteristics Symbol Parameter V supply voltage DD I supply current DD V enable voltage en Pin SDA V LOW-level input voltage IL V HIGH-level input voltage IH I LOW-level output current OL I input leakage current LI C input capacitance I Pins A0 and OSCI ...
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... NXP Semiconductors Fig 21. Typical supply current in clock mode as a function of supply voltage PCF8583 Product data sheet (μ ° kHz; T SCL amb All information provided in this document is subject to legal disclaimers. Rev. 06 — 6 October 2010 PCF8583 Clock and calendar with 240 x 8-bit RAM ...
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... NXP Semiconductors 10.2 Dynamic characteristics Table 8. Dynamic characteristics Symbol Parameter Oscillator C capacitance on pin OSCO OSCO Δf /f relative oscillator frequency osc osc variation f external clock frequency clk(ext) Quartz crystal parameters (f = 32.768 kHz) R series resistance S C parallel load capacitance L C trimmer capacitance ...
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... NXP Semiconductors START PROTOCOL CONDITION (S) t SU;STA SCL t BUF SDA t HD;STA 2 Fig 22. I C-bus timing diagram; rise and fall times refer to V PCF8583 Product data sheet BIT 7 BIT 6 MSB (A6) (A7 LOW HIGH SCL SU;DAT HD;DAT IL All information provided in this document is subject to legal disclaimers. ...
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... NXP Semiconductors 11. Application information 11.1 Quartz frequency adjustment 11.1.1 Method 1: Fixed OSCI capacitor By evaluating the average capacitance necessary for the application layout, a fixed capacitor can be used. The frequency is measured using the 1 Hz signal available after power-on at the interrupt output (pin 7). The frequency tolerance depends on the quartz crystal tolerance, the capacitor tolerance and the device-to-device tolerance. Average deviations of ± ...
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... NXP Semiconductors Fig 23. Application example PCF8583 Product data sheet SCL CLOCK/CALENDAR OSCI PCF8583 SDA OSCO SCL EVENT COUNTER OSCI PCF8583 SDA OSCO V SS All information provided in this document is subject to legal disclaimers. Rev. 06 — 6 October 2010 PCF8583 Clock and calendar with 240 x 8-bit RAM ...
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... NXP Semiconductors 12. Package outline DIP8: plastic dual in-line package; 8 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. mm 4.2 0.51 3.2 inches 0.17 0.02 0.13 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. ...
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... NXP Semiconductors SO8: plastic small outline package; 8 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.3 2.45 mm 2.65 0.25 0.1 2.25 0.012 0.096 inches 0.1 0.01 0.004 0.089 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors HVQFN20: plastic thermal enhanced very thin quad flat package; no leads; 20 terminals; body 0.85 mm terminal 1 index area terminal 1 20 index area DIMENSIONS (mm are the original dimensions) (1) A UNIT max. 0.05 0. 0.2 0.00 0.23 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. ...
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... NXP Semiconductors 13. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 13.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits ...
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... NXP Semiconductors 13.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • ...
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... NXP Semiconductors Fig 27. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. PCF8583 Product data sheet maximum peak temperature = MSL limit, damage level temperature minimum peak temperature = minimum soldering temperature MSL: Moisture Sensitivity Level All information provided in this document is subject to legal disclaimers ...
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... NXP Semiconductors 14. Abbreviations Table 11. Acronym AM BCD CDM CMOS ESD HBM LSB MM MSB MSL MUX PCB PM POR PPM RF RAM SCL SDA SMD PCF8583 Product data sheet Abbreviations Description Ante Meridiem Binary Coded Decimal Charged-Device Model Complementary Metal-Oxide Semiconductor ElectroStatic Discharge Human Body Model ...
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... NXP Semiconductors 15. References [1] AN10365 — Surface mount reflow soldering description [2] IEC 60134 — Rating systems for electronic tubes and valves and analogous semiconductor devices [3] IEC 61340-5 — Protection of electronic devices from electrostatic phenomena [4] IPC/JEDEC J-STD-020 — Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices [5] JESD22-A114 — ...
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... Release date PCF8583 v.6 20101006 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Add HVQFN20 package PCF8583_5 19970715 ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... For sales office addresses, please send an email to: PCF8583 Product data sheet own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 19. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Functional description . . . . . . . . . . . . . . . . . . . 5 7.1 Counter function modes . . . . . . . . . . . . . . . . . . 5 7.2 Alarm function modes . . . . . . . . . . . . . . . . . . . . 5 7.3 Control and status register . . . . . . . . . . . . . . . . 6 7 ...