AD9411BSV-200 Analog Devices Inc, AD9411BSV-200 Datasheet - Page 27

• Manufacturer Part Number: AD9411BSV-200
• Description: IC ADC 10BIT 200MSPS 100-TQFP
• Manufacturer: Analog Devices Inc

Specifications of AD9411BSV-200

• Rohs Status: RoHS non-compliant
• Number Of Bits: 10
• Sampling Rate (per Second): 200M
• Data Interface: Parallel
• Number Of Converters: 1
• Power Dissipation (max): 1.59W
• Voltage Supply Source: Single Supply
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 100-TQFP Exposed Pad

OUTLINE DIMENSIONS
ORDERING GUIDE
Model
AD9411BSV-170
AD9411BSV-200
AD9411/PCB
Temperature
Range
–40°C to +85°C
–40°C to +85°C
SEATING
NOTES
1. CENTER FIGURES ARE TYPICAL UNLESS OTHERWISE NOTED.
2. THE AD9411 HAS A CONDUCTIVE HEAT SLUG TO HELP DISSIPATE HEAT AND ENSURE RELIABLE OPERATION OF
PLANE
THE DEVICE OVER THE FULL INDUSTRIAL TEMPERATURE RANGE. THE SLUG IS EXPOSED ON THE BOTTOM OF
THE PACKAGE AND ELECTRICALLY CONNECTED TO CHIP GROUND. IT IS RECOMMENDED THAT NO PCB SIGNAL
TRACES OR VIAS BE LOCATED UNDER THE PACKAGE THAT COULD COME IN CONTACT WITH THE CONDUCTIVE
SLUG. ATTACHING THE SLUG TO A GROUND PLANE WILL REDUCE THE JUNCTION TEMPERATURE OF THE
DEVICE WHICH MAY BE BENEFICIAL IN HIGH TEMPERATURE ENVIRONMENTS.
0.75
0.60
0.45
0.20
0.09
MAX
1.20
3.5°
7°
0°
Figure 54. 100-Lead Thin Plastic Quad Flat Package, Exposed Pad [TQFP/EP]
25
1
100
26
0.50 BSC
Package Description
TQFP/EP
TQFP/EP
EVALUATION BOARD
COMPLIANT TO JEDEC STANDARDS MS-026AED-HD
(PINS DOWN)
TOP VIEW
16.00 SQ
14.00 SQ
Dimensions shown in millimeters
0.27
0.22
0.17
Rev. A | Page 27 of 28
(SV-100)
0.15
0.05
50
76
75
51
1.05
1.00
0.95
COPLANARITY
0.08
75
51
50
76
CONDUCTIVE
Package Option
SV-100
SV-100
HEAT SINK
NOM
6.50
100
26
1
25
AD9411