X9252YV24IZ-2.7 Intersil, X9252YV24IZ-2.7 Datasheet - Page 2

• Manufacturer Part Number: X9252YV24IZ-2.7
• Description: IC POT DGTL QUAD 24-TSSOP
• Manufacturer: Intersil
• Series: XDCP™r

Specifications of X9252YV24IZ-2.7

• Taps: 256
• Resistance (ohms): 2.8K
• Number Of Circuits: 4
• Temperature Coefficient: 300 ppm/°C Typical
• Memory Type: Non-Volatile
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-TSSOP
• Resistance In Ohms: 2.80K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Ordering Information
Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
Functional Diagram
Pin Descriptions
X9252YS24I-2.7
X9252YS24IZ-2.7 (Note)
X9252YV24I-2.7
X9252YV24IZ-2.7 (Note)
X9252WS24I-2.7
X9252WS24IZ-2.7 (Note)
X9252WV24I-2.7
X9252WV24IZ-2.7 (Note)
X9252US24I-2.7
X9252US24IZ-2.7 (Note)
X9252UV24I-2.7
X9252UV24IZ-2.7 (Note)
X9252TS24I-2.7
X9252TS24IZ-2.7 (Note)
X9252TV24I-2.7
X9252TV24IZ-2.7 (Note)
SOIC/TSSOP PIN
SDA
SCL
DS0
DS1
U/D
CS
A2
A1
A0
PART NUMBER
1
2
3
4
Up-Down
Interface
Interface
2-Wire
V
V
CC
SS
INTERFACE
POWER UP,
CONTROL
SYMBOL
STATUS
AND
X9252YV G
X9252YV Z G
X9252WS G
X9252WS Z G
X9252WV G
X9252WV Z G
X9252US G
X9252US Z G
X9252UV G
X9252UV Z G
X9252TS G
X9252TS Z G
X9252TV G
X9252TV Z G
RW3
DS0
RH3
A0
2
PART MARKING
DCP select for Up/Down interface.
Device address for 2-wire bus.
Wiper terminal of DCP3.
High terminal of DCP3.
WP
WCR0
DR00
DR01
DR02
DR03
R
TOTAL
R
W0
100
2.8
DCP0
10
50
X9252
(kΩ)
R
R
L0
H0
WCR1
DR10
DR11
DR12
DR13
BRIEF DESCRIPTION
TEMP RANGE (°C)
R
W1
DCP1
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
R
R
H1
L1
WCR2
DR20
DR21
DR22
DR23
R
24 Ld SOIC (300 mil)
24 Ld SOIC (300 mil) (Pb-Free)
24 Ld TSSOP (4.4mm)
24 Ld TSSOP (4.4mm) (Pb-free)
24 Ld SOIC (300 mil)
24 Ld SOIC (300 mil) (Pb-Free)
24 Ld TSSOP (4.4mm)
24 Ld TSSOP (4.4mm) (Pb-free)
24 Ld SOIC (300 mil) (Pb-Free)
24 Ld TSSOP (4.4mm)
24 Ld TSSOP (4.4mm) (Pb-free)
24 Ld SOIC (300 mil) (Pb-Free)
24 Ld TSSOP (4.4mm)
24 Ld TSSOP (4.4mm) (Pb-free)
24 Ld SOIC (300 mil)
24 Ld SOIC (300 mil)
W2
DCP2
R
R
H2
L2
WCR3
DR30
DR31
DR32
DR33
PACKAGE
R
W3
DCP3
November 14, 2005
R
R
H3
L3
FN8167.2