MCP4151-104E/P Microchip Technology, MCP4151-104E/P Datasheet - Page 74

IC POT DGTL SNGL 100K SPI 8DIP

MCP4151-104E/P

Manufacturer Part Number
MCP4151-104E/P
Description
IC POT DGTL SNGL 100K SPI 8DIP
Manufacturer
Microchip Technology
Datasheets

Specifications of MCP4151-104E/P

Package / Case
8-DIP (0.300", 7.62mm)
Taps
257
Resistance (ohms)
100K
Number Of Circuits
1
Temperature Coefficient
150 ppm/°C Typical
Memory Type
Volatile
Interface
SPI Serial
Voltage - Supply
1.8 V ~ 5.5 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Through Hole
Resistance In Ohms
100K
Number Of Pots
Single
Taps Per Pot
256
Resistance
100 KOhms
Wiper Memory
Volatile
Digital Interface
Serial (SPI)
Operating Supply Voltage
2.5 V or 3.3 V or 5 V
Supply Current
1 mA
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Mounting Style
Through Hole
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.8 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCP4151-104E/P
Manufacturer:
NXP
Quantity:
1 799
MCP413X/415X/423X/425X
DS22060A-page 74
14-Lead Plastic Small Outline (SL) – Narrow, 3.90 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
A
A1
1
N
2
b
3
D
Dimension Limits
e
Units
A1
E1
A2
L1
E1
N
A
E
D
α
e
h
L
φ
c
b
β
A2
E
1.25
0.10
0.25
0.40
0.17
0.31
MIN
φ
L
MILLIMETERS
h
1.27 BSC
6.00 BSC
3.90 BSC
8.65 BSC
1.04 REF
L1
NOM
14
Microchip Technology Drawing C04-065B
h
© 2007 Microchip Technology Inc.
MAX
β
1.75
0.25
0.50
1.27
0.25
0.51
15°
15°
α
c

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