AD5175BRMZ-10 Analog Devices Inc, AD5175BRMZ-10 Datasheet - Page 20

• Manufacturer Part Number: AD5175BRMZ-10
• Description: IC DGTL POT 1024POS 10K 10MSOP
• Manufacturer: Analog Devices Inc

Specifications of AD5175BRMZ-10

• Taps: 1024
• Resistance (ohms): 10K
• Number Of Circuits: 1
• Temperature Coefficient: 35 ppm/°C Typical
• Memory Type: Non-Volatile
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 2.7 V ~ 5.5 V, ±2.5 V ~ 2.75 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 10-MSOP, Micro10™, 10-uMAX, 10-uSOP
• Resistance In Ohms: 10K
• End To End Resistance: 10kohm
• Resistance Tolerance: -15% To +15%
• No. Of Steps: 1024
• Supply Voltage Range: 2.7V To 5.5V, ± 2.7V
• Control Interface: I2C, Serial
• No. Of Pots: Single
• Memory: RoHS Compliant
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

AD5175
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
AD5175BRMZ-10
AD5175BRMZ-10-RL7
AD5175BCPZ-10-RL7
1
I
©2010 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
2
Z = RoHS Compliant Part.
C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
1
R
10
10
10
AB
PIN 1 INDEX
SEATING
(kΩ)
PLANE
AREA
0.80
0.75
0.70
IDENTIFIER
Resolution
1,024
1,024
1,024
D08719-0-7/10(A)
COPLANARITY
3.10
3.00
2.90
0.95
0.85
0.75
0.15
0.05
PIN 1
0.10
Figure 31. 10-Lead Frame Chip Scale Package [LFCSP_WD]
Figure 32. 10-Lead Mini Small Outline Package [MSOP]
TOP VIEW
0.30
0.25
0.20
3.10
3.00 SQ
2.90
COMPLIANT TO JEDEC STANDARDS MO-187-BA
0.50 BSC
10
1
3 mm × 3 mm Body, Very Thin, Dual Lead
3.10
3.00
2.90
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
Dimensions shown in millimeters
Dimensions shown in millimeters
6
5
0.30
0.15
Rev. A | Page 20 of 20
1.10 MAX
5.15
4.90
4.65
0.20 REF
(CP-10-9)
(RM-10)
0.05 MAX
0.02 NOM
0.50
0.40
0.30
6°
0°
15° MAX
6
5
0.23
0.13
BOTTOM VIEW
Package Description
10-Lead MSOP
10-Lead MSOP
10-Lead LFCSP_WD
2.48
2.38
2.23
EXPOSED
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
PAD
10
1
0.70
0.55
0.40
0.50 BSC
1.74
1.64
1.49
Package Option
RM-10
RM-10
CP-10-9
DDR
DDR
Branding
DEG