AD5175BRMZ-10 Analog Devices Inc, AD5175BRMZ-10 Datasheet - Page 6

• Manufacturer Part Number: AD5175BRMZ-10
• Description: IC DGTL POT 1024POS 10K 10MSOP
• Manufacturer: Analog Devices Inc

Specifications of AD5175BRMZ-10

• Taps: 1024
• Resistance (ohms): 10K
• Number Of Circuits: 1
• Temperature Coefficient: 35 ppm/°C Typical
• Memory Type: Non-Volatile
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 2.7 V ~ 5.5 V, ±2.5 V ~ 2.75 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 10-MSOP, Micro10™, 10-uMAX, 10-uSOP
• Resistance In Ohms: 10K
• End To End Resistance: 10kohm
• Resistance Tolerance: -15% To +15%
• No. Of Steps: 1024
• Supply Voltage Range: 2.7V To 5.5V, ± 2.7V
• Control Interface: I2C, Serial
• No. Of Pots: Single
• Memory: RoHS Compliant
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

AD5175
ABSOLUTE MAXIMUM RATINGS
T
Table 3.
Parameter
V
V
V
V
Digital Input and Output Voltage to GND
EXT_CAP to V
I
Operating Temperature Range
Maximum Junction Temperature
Storage Temperature Range
Reflow Soldering
Package Power Dissipation
1
2
3
A
Maximum terminal current is bounded by the maximum current handling of
the switches, maximum power dissipation of the package, and maximum
applied voltage across any two of the A and W terminals at a given
resistance.
Pulse duty factor.
Includes programming of 50-TP memory.
DD
SS
DD
A
A
, I
, V
Pulsed
Continuous
(T
Peak Temperature
Time at Peak Temperature
= 25°C, unless otherwise noted.
W
to GND
to GND
to V
J
W
Frequency > 10 kHz
Frequency ≤ 10 kHz
Maximum)
to GND
SS
1
SS
3
Rating
–0.3 V to +7.0 V
+0.3 V to −7.0 V
7 V
V
−0.3 V to V
7 V
±6 mA/d
±6 mA/√d
±6 mA
−40°C to +125°C
150°C
−65°C to +150°C
260°C
20 sec to 40 sec
(T
SS
J
max − T
− 0.3 V, V
2
2
DD
A
DD
)/θ
+ 0.3 V
+ 0.3 V
JA
Rev. A | Page 6 of 20
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or
any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
dependent on the test board and test environment.
Table 4. Thermal Resistance
Package Type
10-Lead LFCSP
10-Lead MSOP
1
ESD CAUTION
JEDEC 2S2P test board, still air (0 m/sec airflow).
JA
is defined by JEDEC specification JESD-51 and the value is
θ
50
135
JA
1
θ
3
N/A
JC
Unit
°C/W
°C/W