X9015US8IZT1 Intersil, X9015US8IZT1 Datasheet - Page 11
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X9015US8IZT1
Manufacturer Part Number
X9015US8IZT1
Description
IC XDCP SGL 32-TAP 50K 8-SOIC
Manufacturer
Intersil
Series
XDCP™r
Datasheet
1.X9015US8I.pdf
(11 pages)
Specifications of X9015US8IZT1
Taps
128
Resistance (ohms)
50K
Number Of Circuits
1
Temperature Coefficient
300 ppm/°C Typical
Memory Type
Volatile
Interface
Up/Down (3-Wire)
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Resistance In Ohms
50K
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
X9015US8IZT1
Manufacturer:
Intersil
Quantity:
1 700
Mini Small Outline Plastic Packages (MSOP)
NOTES:
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
A
10. Datums
11. Controlling dimension: MILLIMETER. Converted inch dimen-
1. These package dimensions are within allowable dimensions of
2. Dimensioning and tolerancing per ANSI Y14.5M-1994.
3. Dimension “D” does not include mold flash, protrusions or gate
4. Dimension “E1” does not include interlead flash or protrusions
5. Formed leads shall be planar with respect to one another within
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
A1
INDEX
AREA
JEDEC MO-187BA.
burrs and are measured at Datum Plane. Mold flash, protrusion
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
and are measured at Datum Plane.
protrusions shall not exceed 0.15mm (0.006 inch) per side.
0.10mm (0.004) at seating Plane.
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
sions are for reference only.
A2
- H -
-H-
.
SIDE VIEW
TOP VIEW
-A -
N
1 2
e
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
D
and
b
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
- B -
For information regarding Intersil Corporation and its products, see www.intersil.com
E1
SEATING
-A-
PLANE
0.10 (0.004)
0.20 (0.008)
GAUGE
PLANE
-B-
to be determined at Datum plane
0.20 (0.008)
11
E
0.20 (0.008)
-C-
(0.010)
0.25
C
C
- H -
a
A B C
SEATING
PLANE
C D
Interlead flash and
4X θ
END VIEW
4X θ
E
L1
C L
1
C
L
R1
-B-
R
X9015
M8.118 (JEDEC MO-187AA)
8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
A1
A2
E1
R1
L1
D
N
R
α
A
b
e
E
L
0
c
0.037
0.002
0.030
0.010
0.004
0.116
0.116
0.187
0.016
0.003
0.003
MIN
5
0
0.026 BSC
0.037 REF
o
o
INCHES
8
MAX
0.043
0.006
0.037
0.014
0.008
0.120
0.120
0.199
0.028
15
6
-
-
o
o
0.94
0.05
0.75
0.25
0.09
2.95
2.95
4.75
0.40
0.07
0.07
MILLIMETERS
MIN
5
0
o
o
0.65 BSC
0.95 REF
8
MAX
1.10
0.15
0.95
0.36
0.20
3.05
3.05
5.05
0.70
15
6
-
-
o
o
August 31, 2006
Rev. 2 01/03
NOTES
FN8157.5
9
3
4
6
7
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