X9317TS8Z Intersil, X9317TS8Z Datasheet - Page 12

• Manufacturer Part Number: X9317TS8Z
• Description: IC XDCP 100TAP 100K 3WIRE 8-SOIC
• Manufacturer: Intersil
• Series: XDCP™r

Specifications of X9317TS8Z

• Taps: 100
• Resistance (ohms): 100K
• Number Of Circuits: 1
• Temperature Coefficient: 300 ppm/°C Typical
• Memory Type: Non-Volatile
• Interface: Up/Down (3-Wire)
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Resistance In Ohms: 100K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Mini Small Outline Plastic Packages (MSOP)
NOTES:
A
10. Datums
11. Controlling dimension: MILLIMETER. Converted inch dimen-
1. These package dimensions are within allowable dimensions of
2. Dimensioning and tolerancing per ANSI Y14.5M-1994.
3. Dimension “D” does not include mold flash, protrusions or gate
4. Dimension “E1” does not include interlead flash or protrusions
5. Formed leads shall be planar with respect to one another within
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
A1
INDEX
AREA
JEDEC MO-187BA.
burrs and are measured at Datum Plane. Mold flash, protrusion
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
and are measured at Datum Plane.
protrusions shall not exceed 0.15mm (0.006 inch) per side.
0.10mm (0.004) at seating Plane.
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
sions are for reference only.
A2
- H -
-H-
.
SIDE VIEW
TOP VIEW
-A -
N
1 2
e
D
and
b
- B -
E1
SEATING
-A-
PLANE
0.10 (0.004)
0.20 (0.008)
GAUGE
PLANE
-B-
to be determined at Datum plane
0.20 (0.008)
12
E
0.20 (0.008)
-C-
(0.010)
0.25
C
C
- H -
a
A B C
SEATING
PLANE
C D
Interlead flash and
4X θ
END VIEW
4X θ
E
L1
C L
1
C
L
R1
-B-
R
X9317
M8.118 (JEDEC MO-187AA)
8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
A1
A2
E1
R1
L1
D
N
R
α
A
b
e
E
L
0
c
0.037
0.002
0.030
0.010
0.004
0.116
0.116
0.187
0.016
0.003
0.003
MIN
5
0
0.026 BSC
0.037 REF
o
o
INCHES
8
MAX
0.043
0.006
0.037
0.014
0.008
0.120
0.120
0.199
0.028
15
6
-
-
o
o
0.94
0.05
0.75
0.25
0.09
2.95
2.95
4.75
0.40
0.07
0.07
MILLIMETERS
MIN
5
0
o
o
0.65 BSC
0.95 REF
8
MAX
1.10
0.15
0.95
0.36
0.20
3.05
3.05
5.05
0.70
15
6
-
-
o
o
December 16, 2009
Rev. 2 01/03
NOTES
FN8183.6
9
3
4
6
7
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