ADP8861ACPZ-R7 Analog Devices Inc, ADP8861ACPZ-R7 Datasheet - Page 5

• Manufacturer Part Number: ADP8861ACPZ-R7
• Description: Charge Pump Based Backlight Controller
• Manufacturer: Analog Devices Inc
• Series: -r

Specifications of ADP8861ACPZ-R7

• Constant Current: -
• Constant Voltage: -
• Topology: Switched Capacitor (Charge Pump)
• Number Of Outputs: 7
• Internal Driver: Yes
• Type - Primary: Backlight, LED Blinker
• Type - Secondary: RGB, White LED
• Frequency: 800kHz ~ 1.32MHz
• Voltage - Supply: 2.5 V ~ 5.5 V
• Voltage - Output: 4.3 V ~ 5.5 V
• Mounting Type: Surface Mount
• Package / Case: 20-WFQFN Exposed Pad, CSP
• Operating Temperature: -40°C ~ 85°C
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
VIN, VOUT
D1, D2, D3, D4, D5, D6, and D7
nINT, nRST, SCL, and SDA
Output Short-Circuit Duration
Operating Temperature Range
Storage Temperature Range
Soldering Conditions
ESD (Electrostatic Discharge)
1
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all voltages are
referenced to ground.
The maximum operating junction temperature (T
over the maximum operating ambient temperature (T
Maximum Temperature Ranges section for more information.
Ambient (T
Junction (T
Human Body Model (HBM)
Charged Device Model (CDM)
J
A
)
)
J(MAX)
) takes precedence
A(MAX)
Rating
−0.3 V to +6 V
−0.3 V to +6 V
−0.3 V to +6 V
Indefinite
–40°C to +85°C
–40°C to +125°C
–65°C to +150°C
JEDEC J-STD-020
±3 kV
±1.5 kV
). See the
1
Rev. A | Page 5 of 40
MAXIMUM TEMPERATURE RANGES
The maximum operating junction temperature (T
precedence over the maximum operating ambient temperature
(T
exposed to poor thermal resistance and high power dissipation
(P
derated. In these cases, the maximum ambient temperature can
be calculated with the following equation:
THERMAL RESISTANCE
θ
that is, a device soldered in a circuit board for surface-mount
packages. The θ
case) are determined according to JESD51-9 on a 4-layer
printed circuit board (PCB) with natural convection cooling.
For the LFCSP package, the exposed pad must be soldered to
GND.
Table 3. Thermal Resistance
Package Type
WLCSP
LFCSP
1
ESD CAUTION
N/A stands for not applicable.
JA
D
A(MAX)
(junction to air) is specified for the worst-case conditions,
), the maximum ambient temperature may need to be
T
A(MAX)
). Therefore, in situations where the ADP8861 is
= T
J(MAX)
JA
, θ
θ
48
49.5
JB
JA
− (θ
(junction to board), and θ
JA
× P
θ
9
N/A
D(MAX)
JB
1
)
θ
N/A
5.3
JC
1
JC
(junction to
ADP8861
J(MAX)
Unit
°C/W
°C/W
) takes