X9259US24 Intersil, X9259US24 Datasheet - Page 20

IC DCP QUAD 50K 256TP 24SOIC

X9259US24

Manufacturer Part Number
X9259US24
Description
IC DCP QUAD 50K 256TP 24SOIC
Manufacturer
Intersil
Series
XDCP™r
Datasheet

Specifications of X9259US24

Taps
256
Resistance (ohms)
50K
Number Of Circuits
4
Temperature Coefficient
300 ppm/°C Typical
Memory Type
Non-Volatile
Interface
I²C, 2-Wire Serial
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
24-SOIC (7.5mm Width)
Resistance In Ohms
50K
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
X9259US24
Manufacturer:
XICOR
Quantity:
3 987
Part Number:
X9259US24I
Manufacturer:
Intersil
Quantity:
3 000
Part Number:
X9259US24IZ
Manufacturer:
Intersil
Quantity:
3 000
Part Number:
X9259US24Z
Manufacturer:
Intersil
Quantity:
3 000
Small Outline Plastic Packages (SOIC)
NOTES:
10. Controlling dimension: MILLIMETER. Converted inch dimensions
N
1
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
5. The chamfer on the body is optional. If it is not present, a visual index
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
0.25(0.010)
Publication Number 95.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
feature must be located within the crosshatched area.
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
are not necessarily exact.
2
-A-
INDEX
AREA
3
e
B
D
M
C A
SEATING PLANE
M
E
-C-
-B-
B S
A
20
H
A1
0.10(0.004)
0.25(0.010)
α
M
L
h x 45°
B
M
C
X9259
M24.3
24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
A1
A
B
C
D
E
H
N
α
e
h
L
(JEDEC MS-013-AD ISSUE C)
0.0926
0.0040
0.013
0.0091
0.5985
0.2914
0.394
0.010
0.016
MIN
0.05 BSC
INCHES
24
0.1043
0.0118
0.020
0.0125
0.6141
0.2992
0.419
0.029
0.050
MAX
15.20
10.00
2.35
0.10
0.33
0.23
7.40
0.25
0.40
MILLIMETERS
MIN
1.27 BSC
24
15.60
10.65
MAX
2.65
0.30
0.51
0.32
7.60
0.75
1.27
Rev. 1 4/06
April 13, 2007
NOTES
FN8169.5
9
3
4
5
6
7
-
-
-
-
-
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