X9C303S8 Intersil, X9C303S8 Datasheet - Page 8

IC DCP 32K 100TP LOG TAPR 8SOIC

X9C303S8

Manufacturer Part Number
X9C303S8
Description
IC DCP 32K 100TP LOG TAPR 8SOIC
Manufacturer
Intersil
Series
XDCP™r
Datasheet

Specifications of X9C303S8

Taps
100
Resistance (ohms)
32K
Number Of Circuits
1
Temperature Coefficient
300 ppm/°C Typical
Memory Type
Non-Volatile
Interface
Up/Down (3-Wire)
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Resistance In Ohms
32K
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
X9C303S8IZ
Manufacturer:
Intersil
Quantity:
200
Part Number:
X9C303S8ZT1
Manufacturer:
INTERSIL
Quantity:
20 000
Thin Shrink Small Outline Plastic Packages (TSSOP)
NOTES:
10. Controlling dimension: MILLIMETER. Converted inch dimensions
N
1
1. These package dimensions are within allowable dimensions of
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
4. Dimension “E1” does not include interlead flash or protrusions. Inter-
5. The chamfer on the body is optional. If it is not present, a visual index
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable dambar
0.10(0.004)
JEDEC MO-153-AC, Issue E.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per
side.
feature must be located within the crosshatched area.
protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimen-
sion at maximum material condition. Minimum space between protru-
sion and adjacent lead is 0.07mm (0.0027 inch).
are not necessarily exact. (Angles in degrees)
2
-A-
INDEX
AREA
3
e
0.05(0.002)
b
D
M
C A
SEATING PLANE
M
E1
-C-
-B-
B S
A
8
E
A1
α
0.10(0.004)
0.25(0.010)
GAUGE
PLANE
0.010
A2
M
0.25
B
M
L
c
X9C303
M8.173
8 LEAD THIN SHRINK NARROW BODY SMALL OUTLINE
PLASTIC PACKAGE
SYMBOL
A1
A2
E1
A
D
E
N
α
b
c
e
L
0.002
0.031
0.0075
0.0035
0.116
0.169
0.246
0.0177
MIN
0
-
0.026 BSC
o
INCHES
8
0.047
0.006
0.051
0.0118
0.0079
0.120
0.177
0.256
0.0295
MAX
8
o
MILLIMETERS
0.05
0.80
0.19
0.09
2.95
4.30
6.25
0.45
MIN
0
-
o
0.65 BSC
8
MAX
1.20
0.15
1.05
0.30
0.20
3.05
4.50
6.50
0.75
8
o
January 30, 2009
Rev. 1 12/00
NOTES
FN8223.2
9
3
4
6
7
-
-
-
-
-
-
-

Related parts for X9C303S8