X9314WS-3T1 Intersil, X9314WS-3T1 Datasheet - Page 7
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X9314WS-3T1
Manufacturer Part Number
X9314WS-3T1
Description
IC XDCP SGL 32-TAP 10K 8-SOIC
Manufacturer
Intersil
Series
XDCP™r
Datasheet
1.X9314WS.pdf
(9 pages)
Specifications of X9314WS-3T1
Taps
32
Resistance (ohms)
10K
Number Of Circuits
1
Temperature Coefficient
300 ppm/°C Typical
Memory Type
Non-Volatile
Interface
Up/Down (3-Wire)
Voltage - Supply
3 V ~ 5.5 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Resistance In Ohms
10K
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Mini Small Outline Plastic Packages (MSOP)
NOTES:
A
10. Datums
11. Controlling dimension: MILLIMETER. Converted inch dimen-
1. These package dimensions are within allowable dimensions of
2. Dimensioning and tolerancing per ANSI Y14.5M-1994.
3. Dimension “D” does not include mold flash, protrusions or gate
4. Dimension “E1” does not include interlead flash or protrusions
5. Formed leads shall be planar with respect to one another within
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
A1
INDEX
AREA
JEDEC MO-187BA.
burrs and are measured at Datum Plane. Mold flash, protrusion
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
and are measured at Datum Plane.
protrusions shall not exceed 0.15mm (0.006 inch) per side.
0.10mm (0.004) at seating Plane.
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
sions are for reference only.
A2
- H -
-H-
.
SIDE VIEW
TOP VIEW
-A -
N
1 2
e
D
and
b
- B -
E1
SEATING
-A-
PLANE
0.10 (0.004)
0.20 (0.008)
GAUGE
PLANE
-B-
to be determined at Datum plane
0.20 (0.008)
7
E
0.20 (0.008)
-C-
(0.010)
0.25
C
C
- H -
a
A B C
SEATING
PLANE
C D
Interlead flash and
4X θ
END VIEW
4X θ
E
L1
C L
1
C
L
R1
-B-
R
X9314
M8.118 (JEDEC MO-187AA)
8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
A1
A2
E1
R1
L1
D
N
R
α
A
b
e
E
L
0
c
0.037
0.002
0.030
0.010
0.004
0.116
0.116
0.187
0.016
0.003
0.003
MIN
5
0
0.026 BSC
0.037 REF
o
o
INCHES
8
MAX
0.043
0.006
0.037
0.014
0.008
0.120
0.120
0.199
0.028
15
6
-
-
o
o
0.94
0.05
0.75
0.25
0.09
2.95
2.95
4.75
0.40
0.07
0.07
MILLIMETERS
MIN
5
0
o
o
0.65 BSC
0.95 REF
8
MAX
1.10
0.15
0.95
0.36
0.20
3.05
3.05
5.05
0.70
15
6
-
-
o
o
September 5, 2006
Rev. 2 01/03
NOTES
FN8178.2
9
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6
7
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