1954289-3 TE Connectivity, 1954289-3 Datasheet - Page 2
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1954289-3
Manufacturer Part Number
1954289-3
Description
BOARD-BOARD CONN, RECEPTACLE, 6WAY, 1ROW
Manufacturer
TE Connectivity
Series
Hermaphroditicr
Specifications of 1954289-3
Pitch Spacing
4mm
No. Of Rows
1
No. Of Contacts
6
Gender
Receptacle
Contact Termination
Surface Mount Horizontal
Contact Plating
Tin
Contact Material
Copper Alloy
Rohs Compliant
Yes
Product Type
Connector
Connector Type
Housing
Sealed
No
Termination Method To Pc Board
Surface Mount
Pcb Mount Retention
With
Pcb Mount Alignment
Without
Smt Compatible
Yes
Mount Angle
Right Angle
Ul File Number
E28476
Keyed
No
Make First / Break Last
No
Contact Current Rating, Max (a)
5
Operating Voltage (vac)
90
Operating Voltage (vdc)
90
Tail Orientation
In-line
Profile Height (y-axis) (mm [in])
4.13 [0.163]
Centerline (mm [in])
4.00 [0.157]
Number Of Positions
6
Number Of Rows
1
Length (x-axis) (mm [in])
12.25 [0.482]
Width (z-axis) (mm [in])
23.90 [0.940]
Post-mating Assembly Measurement (mm [in])
7.5 [0.295]
Mating Retention
Without
Header Mating Direction
Horizontal
Pcb Mount Retention Type
Solder Pads
Tail Plating Material
Matte Tin-Lead over Nickel
Tail Plating, Thickness (µm [?in])
5 [191.85]
Contact Type
Blade/Socket
Contact Plating, Mating Area, Material
Matte Tin
Contact Plating, Mating Area, Thickness (µm [?in])
5 [196.85]
Stamped And Formed
Yes
Connector Style
Hermaphroditic
Mating Alignment
With
Housing Material
Liquid Crystal Polymer (LCP)
Housing Color
White
Ul Flammability Rating
UL 94V-0
Agency/standard
CSA, UL
Agency/standard Number
C22.2 No. 182.3-M1987, UL 1977
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Reflow solder capable to 245°C, Reflow solder capable to 260°C
Rohs/elv Compliance History
Always was RoHS compliant
Circuit Identification Feature
Without
Operating Temperature (°c [°f])
-40 – +105 [-40 – +221]
Applies To
Printed Circuit Board
Lighting Interconnect Level
Level 2
Smt Soldering Temperature (°c [°f])
260 [500]
Glow Wire Rating
No
Uv Exposure Rated
No
Application Use
Board-to-Board
Packaging Method
Tape & Reel
3.3.
3.4.
3.5.
Initial examination of product.
Final examination of product.
Low Level Contact Resistance
(LLCR).
Insulation resistance.
Withstanding voltage.
Temperature rise vs current.
Resistance to reflow soldering heat. Housing shall be free of deformation
Rev B
Ratings
!
!
!
Performance and Test Description
Product is designed to meet the electrical, mechanical and environmental performance requirements
specified in Figure 1. Unless otherwise specified, all tests shall be performed at ambient environmental
conditions.
Test Requirements and Procedures Summary
Test Description
Voltage:
•
•
Current: 6 amperes maximum
Temperature: -40 to 105°C
125 volts AC rms
125 volts DC
Meets requirements of product
drawing and Application
Specification 114-13225.
Meets visual requirements.
18 milliohms maximum initial.
ΔR 5 milliohms maximum.
1 megohm minimum.
One minute hold with no breakdown
or flashover.
30°C maximum temperature rise at
specified current.
and fusion.
See Note.
Figure 1 (continued)
MECHANICAL
ELECTRICAL
Requirement
EIA-364-18.
Visual and dimensional (C of C)
inspection per product drawing.
EIA-364-18.
Visual inspection.
EIA-364-23.
Subject specimens to 100
milliamperes maximum and 20
millivolts maximum open circuit
voltage.
See Figure 3.
EIA-364-21.
500 volts DC, 2 minute hold.
Test between adjacent contacts of
unmated specimens.
EIA-364-20, Condition I.
1500 volts AC at sea level.
Test between adjacent contacts of
unmated specimens.
EIA-364-70, Method 1.
Stabilize at a single current level
until 3 readings at 5 minute intervals
are within 1°C. Energize 100% of
the circuit.
AMP Spec 109-201, Condition B.
Procedure
108-2342
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