1954289-3 TE Connectivity, 1954289-3 Datasheet - Page 5

• Manufacturer Part Number: 1954289-3
• Description: BOARD-BOARD CONN, RECEPTACLE, 6WAY, 1ROW
• Manufacturer: TE Connectivity
• Series: Hermaphroditicr

Specifications of 1954289-3

• Pitch Spacing: 4mm
• No. Of Rows: 1
• No. Of Contacts: 6
• Gender: Receptacle
• Contact Termination: Surface Mount Horizontal
• Contact Plating: Tin
• Contact Material: Copper Alloy
• Rohs Compliant: Yes
• Product Type: Connector
• Connector Type: Housing
• Sealed: No
• Termination Method To Pc Board: Surface Mount
• Pcb Mount Retention: With
• Pcb Mount Alignment: Without
• Smt Compatible: Yes
• Mount Angle: Right Angle
• Ul File Number: E28476
• Keyed: No
• Make First / Break Last: No
• Contact Current Rating, Max (a): 5
• Operating Voltage (vac): 90
• Operating Voltage (vdc): 90
• Tail Orientation: In-line
• Profile Height (y-axis) (mm [in]): 4.13 [0.163]
• Centerline (mm [in]): 4.00 [0.157]
• Number Of Positions: 6
• Number Of Rows: 1
• Length (x-axis) (mm [in]): 12.25 [0.482]
• Width (z-axis) (mm [in]): 23.90 [0.940]
• Post-mating Assembly Measurement (mm [in]): 7.5 [0.295]
• Mating Retention: Without
• Header Mating Direction: Horizontal
• Pcb Mount Retention Type: Solder Pads
• Tail Plating Material: Matte Tin-Lead over Nickel
• Tail Plating, Thickness (µm [?in]): 5 [191.85]
• Contact Type: Blade/Socket
• Contact Plating, Mating Area, Material: Matte Tin
• Contact Plating, Mating Area, Thickness (µm [?in]): 5 [196.85]
• Stamped And Formed: Yes
• Connector Style: Hermaphroditic
• Mating Alignment: With
• Housing Material: Liquid Crystal Polymer (LCP)
• Housing Color: White
• Ul Flammability Rating: UL 94V-0
• Agency/standard: CSA, UL
• Agency/standard Number: C22.2 No. 182.3-M1987, UL 1977
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Reflow solder capable to 245°C, Reflow solder capable to 260°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Circuit Identification Feature: Without
• Operating Temperature (°c [°f]): -40 – +105 [-40 – +221]
• Applies To: Printed Circuit Board
• Lighting Interconnect Level: Level 2
• Smt Soldering Temperature (°c [°f]): 260 [500]
• Glow Wire Rating: No
• Uv Exposure Rated: No
• Application Use: Board-to-Board
• Packaging Method: Tape & Reel

4.
4.1.
4.2.
4.3.
4.4.
Rev B
QUALITY ASSURANCE PROVISIONS
Qualification Testing
A.
B.
Requalification Testing
If changes significantly affecting form, fit or function are made to the product or manufacturing process,
product assurance shall coordinate requalification testing, consisting of all or part of the original testing
sequence as determined by development/product, quality and reliability engineering.
Acceptance
Acceptance is based on verification that the product meets the requirements of Figure 1. Failures
attributed to equipment, test setup or operator deficiencies shall not disqualify the product. If product
failure occurs, corrective action shall be taken and specimens resubmitted for qualification. Testing to
confirm corrective action is required before resubmittal.
Quality Conformance Inspection
The applicable quality inspection plan shall specify the sampling acceptable quality level to be used.
Dimensional and functional requirements shall be in accordance with the applicable product drawing
and this specification.
Specimen Selection
Specimens shall be prepared in accordance with applicable Instruction Sheets and shall be
selected at random from current production. Each test group shall consist of a minimum of 5
specimens soldered to FR-4 printed circuit boards.
Test Sequence
Qualification inspection shall be verified by testing specimens as specified in Figure 2.
LLCR Measurement Points
Figure 3
108-2342
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