1954289-3 TE Connectivity, 1954289-3 Datasheet - Page 5
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1954289-3
Manufacturer Part Number
1954289-3
Description
BOARD-BOARD CONN, RECEPTACLE, 6WAY, 1ROW
Manufacturer
TE Connectivity
Series
Hermaphroditicr
Specifications of 1954289-3
Pitch Spacing
4mm
No. Of Rows
1
No. Of Contacts
6
Gender
Receptacle
Contact Termination
Surface Mount Horizontal
Contact Plating
Tin
Contact Material
Copper Alloy
Rohs Compliant
Yes
Product Type
Connector
Connector Type
Housing
Sealed
No
Termination Method To Pc Board
Surface Mount
Pcb Mount Retention
With
Pcb Mount Alignment
Without
Smt Compatible
Yes
Mount Angle
Right Angle
Ul File Number
E28476
Keyed
No
Make First / Break Last
No
Contact Current Rating, Max (a)
5
Operating Voltage (vac)
90
Operating Voltage (vdc)
90
Tail Orientation
In-line
Profile Height (y-axis) (mm [in])
4.13 [0.163]
Centerline (mm [in])
4.00 [0.157]
Number Of Positions
6
Number Of Rows
1
Length (x-axis) (mm [in])
12.25 [0.482]
Width (z-axis) (mm [in])
23.90 [0.940]
Post-mating Assembly Measurement (mm [in])
7.5 [0.295]
Mating Retention
Without
Header Mating Direction
Horizontal
Pcb Mount Retention Type
Solder Pads
Tail Plating Material
Matte Tin-Lead over Nickel
Tail Plating, Thickness (µm [?in])
5 [191.85]
Contact Type
Blade/Socket
Contact Plating, Mating Area, Material
Matte Tin
Contact Plating, Mating Area, Thickness (µm [?in])
5 [196.85]
Stamped And Formed
Yes
Connector Style
Hermaphroditic
Mating Alignment
With
Housing Material
Liquid Crystal Polymer (LCP)
Housing Color
White
Ul Flammability Rating
UL 94V-0
Agency/standard
CSA, UL
Agency/standard Number
C22.2 No. 182.3-M1987, UL 1977
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Reflow solder capable to 245°C, Reflow solder capable to 260°C
Rohs/elv Compliance History
Always was RoHS compliant
Circuit Identification Feature
Without
Operating Temperature (°c [°f])
-40 – +105 [-40 – +221]
Applies To
Printed Circuit Board
Lighting Interconnect Level
Level 2
Smt Soldering Temperature (°c [°f])
260 [500]
Glow Wire Rating
No
Uv Exposure Rated
No
Application Use
Board-to-Board
Packaging Method
Tape & Reel
4.
4.1.
4.2.
4.3.
4.4.
Rev B
QUALITY ASSURANCE PROVISIONS
Qualification Testing
A.
B.
Requalification Testing
If changes significantly affecting form, fit or function are made to the product or manufacturing process,
product assurance shall coordinate requalification testing, consisting of all or part of the original testing
sequence as determined by development/product, quality and reliability engineering.
Acceptance
Acceptance is based on verification that the product meets the requirements of Figure 1. Failures
attributed to equipment, test setup or operator deficiencies shall not disqualify the product. If product
failure occurs, corrective action shall be taken and specimens resubmitted for qualification. Testing to
confirm corrective action is required before resubmittal.
Quality Conformance Inspection
The applicable quality inspection plan shall specify the sampling acceptable quality level to be used.
Dimensional and functional requirements shall be in accordance with the applicable product drawing
and this specification.
Specimen Selection
Specimens shall be prepared in accordance with applicable Instruction Sheets and shall be
selected at random from current production. Each test group shall consist of a minimum of 5
specimens soldered to FR-4 printed circuit boards.
Test Sequence
Qualification inspection shall be verified by testing specimens as specified in Figure 2.
LLCR Measurement Points
Figure 3
108-2342
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