MAX5873EGK+D Maxim Integrated Products, MAX5873EGK+D Datasheet - Page 2

• Manufacturer Part Number: MAX5873EGK+D
• Description: IC DAC 12BIT 200MSPS DUAL 68-QFN
• Manufacturer: Maxim Integrated Products

Specifications of MAX5873EGK+D

• Settling Time: 14ns
• Number Of Bits: 12
• Data Interface: Parallel
• Number Of Converters: 2
• Voltage Supply Source: Analog and Digital
• Power Dissipation (max): 300mW
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 68-QFN Exposed Pad
• Conversion Rate: 200 MSPs
• Resolution: 12 bit
• Interface Type: Parallel
• Supply Voltage (max): 1.89 V, 3.465 V
• Supply Voltage (min): 1.71 V, 3.135 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
AV
AV
REFIO, FSADJ to GND, DACREF ........-0.3V to (AV
OUTIP, OUTIN, OUTQP, OUTQN
CLKP, CLKN to GND, DACREF..............-0.3V to (AV
A11/B11–A0/B0, XOR, SELIQ to
TORB, DORI, PD to GND, DACREF........-0.3V to (DV
12-Bit, 200Msps, High-Dynamic-Performance,
Dual DAC with CMOS Inputs
ELECTRICAL CHARACTERISTICS
(AV
50Ω double terminated, transformer-coupled output, I
= +25°C.) (Note 2)
Note 1: Themal resistors based on a multilayer board with 4 x 4 via array in exposed paddle area.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
STATIC PERFORMANCE
Resolution
Integral Nonlinearity
Differential Nonlinearity
Offset Error
Offset-Drift Tempco
Full-Scale Gain Error
Gain-Drift Tempco
Full-Scale Output Current
Output Compliance
Output Resistance
Output Capacitance
DYNAMIC PERFORMANCE
Clock Frequency
Output Update Rate
Noise Spectral Density
to GND, DACREF .................................-1V to (AV
GND, DACREF ...................................-0.3V to (DV
DD1.8
DD3.3
DD3.3
_______________________________________________________________________________________
, DV
, DV
= DV
PARAMETER
DD1.8
DD3.3
DD3.3
, AV
to GND, DACREF ................. -0.3V to +2.16V
= AV
CLK
CLK
to GND, DACREF ....... -0.3V to +3.9V
= 3.3V, AV
SYMBOL
C
GE
R
I
f
DNL
f
DD1.8
INL
OUT
DAC
OS
CLK
OUT
OUT
FS
= DV
Measured differentially
Measured differentially
External reference
Internal reference
External reference
(Note 3)
Single-ended
f
f
f
f
DAC
DAC
DAC
DAC
DD3.3
DD3.3
DD3.3
DD1.8
CLK
OUTFS
DD3.3
= f
= f
= 150MHz
= 200MHz
+ 0.3V)
+ 0.3V)
+ 0.3V)
+ 0.3V)
CLK
CLK
= 1.8V, GND = 0, f
+ 0.3
= 20mA, T
, dual-port mode
/ 2, single-port mode
CONDITIONS
f
f
A
OUT
OUT
Continuous Power Dissipation (T
Thermal Resistance θ
Operating Temperature Range ......................... -40°C to +85°C
Junction Temperature .................................................... +150°C
Storage Temperature Range ........................... -60°C to +150°C
Lead Temperature (soldering, 10s) ............................... +300°C
= T
68-Pin QFN-EP
(derate 41.7mW/°C above +70°C) (Note 1) ...........3333.3mW
MIN
= 16MHz, -12dBFS
= 80MHz, -12dBFS
CLK
to T
= f
MAX
DAC
, unless otherwise noted. Typical values are at T
, external reference V
JA
(Note 1)...................................+24°C/W
-0.025
MIN
-0.5
2
1
1
1
A
= +70°C)
±0.001
REFIO
±0.13
±100
-152
-153
TYP
±0.2
±10
±50
12
±1
1
5
= 1.25V, output load
+0.025
MAX
+1.1
200
100
200
20
ppm/°C
ppm/°C
UNITS
dBFS/
Msps
%FS
%FS
MHz
LSB
LSB
Bits
mA
MΩ
pF
Hz
V
A