2008563-1 TE Connectivity, 2008563-1 Datasheet - Page 2

• Manufacturer Part Number: 2008563-1
• Description: WIRE-BOARD CONNECTOR RECEPTACLE 1POS 4MM
• Manufacturer: TE Connectivity
• Series: Poke-Inr

Specifications of 2008563-1

• Connector Type: Wire To Board
• Contact Termination: Surface Mount Horizontal
• Gender: Receptacle
• No. Of Contacts: 1
• Pitch Spacing: 4mm
• Contact Plating: Tin
• Rohs Compliant: Yes
• Make First / Break Last: No
• Sealed: No
• Termination Method To Pc Board: Surface Mount
• Pcb Mount Retention: With
• Pcb Mount Alignment: Without
• Smt Compatible: Yes
• Mount Angle: Right Angle
• Wire/cable Type: Discrete Wire
• Termination Method To Wire/cable: Poke-in
• Ul File Number: E28476
• Keyed: No
• Contact Current Rating, Max (a): 4
• Operating Voltage (vac): 250
• Operating Voltage (vdc): 250
• Wire/cable Size (awg): 18 – 22
• Tool-less Wire Termination: Yes
• Tail Orientation: In-line
• Profile Height (y-axis) (mm [in]): 3.90 [0.154]
• Number Of Positions: 1
• Number Of Rows: 1
• Length (x-axis) (mm [in]): 14.22 [0.560]
• Width (z-axis) (mm [in]): 3.95 [0.156]
• Post-mating Assembly Measurement (mm [in]): 10.5 [0.413]
• Mating Retention: Without
• Header Mating Direction: Horizontal
• Pcb Mount Retention Type: Solder Pads
• Preloaded: Yes
• Tail Plating Material: Matte Tin over Nickel
• Tail Plating, Thickness (µm [?in]): 3 [118.11]
• Contact Type: Socket
• Contact Plating, Mating Area, Material: Matte Tin
• Contact Plating, Mating Area, Thickness (µm [?in]): 3 [118]
• Stamped And Formed: Yes
• Connector Style: Receptacle
• Mating Alignment: Without
• Housing Color: White
• Ul Flammability Rating: UL 94V-0
• Pre-designed Cables Available: No
• Agency/standard: CSA, UL
• Agency/standard Number: C22.2 No. 182.3-M1987, UL 1977
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Reflow solder capable to 245°C, Reflow solder capable to 260°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Circuit Identification Feature: Without
• Operating Temperature (°c [°f]): -40 – +105 [-40 – +221]
• Applies To: Printed Circuit Board, Wire/Cable
• Uv Exposure Rated: No
• Glow Wire Rating: No
• Accepts Wire Insulation Diameter, Range (mm [in]): 2.10 [0.0826]
• Smt Soldering Temperature (°c [°f]): 220 [428]
• Lighting Interconnect Level: Level 2
• Application Use: Wire-to-Board
• Packaging Method: SMT Pocket Tape

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3.2.
3.3.
3.4.
3.5.
Rev B
Initial examination of product.
Final examination of product.
Low Level Contact Resistance
(LLCR).
Withstanding voltage.
Solderability, surface mount.
Resistance to reflow soldering heat. Housing shall be free of
Random vibration.
Materials
Materials used in the construction of this product shall be as specified on the applicable product
drawing.
Ratings
!
!
!
Performance and Test Description
Product is designed to meet the electrical, mechanical and environmental performance requirements
specified in Figure 1. Unless otherwise specified, all tests shall be performed at ambient environmental
conditions.
Test Requirements and Procedures Summary
Test Description
Voltage: 250 volts AC RMS, 250 volts DC
Current: 4 amperes maximum
Temperature: -40 to 105°C
Meets requirements of product
drawing.
Meets visual requirements.
18 milliohms maximum initial.
ΔR 5 milliohms maximum.
One minute hold with no
breakdown or flashover.
Solderable area shall have a
minimum of 95% solder coverage.
deformation and fusion.
See Note.
No discontinuities of 1 microsecond
or longer duration.
See Note.
Figure 1 (continued)
MECHANICAL
ELECTRICAL
Requirement
EIA-364-18.
Visual and dimensional (C of C)
inspection per product drawing.
EIA-364-18.
Visual inspection.
EIA-364-23.
Subject specimens to 100
milliamperes maximum and 20
millivolts maximum open circuit
voltage.
EIA-364-20, Condition I.
1500 volts AC at sea level.
Test between adjacent contacts.
JEDC JESD22-B102.
Subject contacts to solderability.
TE Spec 109-201, Condition B.
EIA-364-28, Test Condition VII,
Condition Letter D.
Subject mated specimens to 3.10
G's rms between 20 to 500 Hz.
Fifteen minutes in each of 3
mutually perpendicular planes.
See Figure 3.
Procedure
108-2284
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