2008563-1 TE Connectivity, 2008563-1 Datasheet - Page 3

• Manufacturer Part Number: 2008563-1
• Description: WIRE-BOARD CONNECTOR RECEPTACLE 1POS 4MM
• Manufacturer: TE Connectivity
• Series: Poke-Inr

Specifications of 2008563-1

• Connector Type: Wire To Board
• Contact Termination: Surface Mount Horizontal
• Gender: Receptacle
• No. Of Contacts: 1
• Pitch Spacing: 4mm
• Contact Plating: Tin
• Rohs Compliant: Yes
• Make First / Break Last: No
• Sealed: No
• Termination Method To Pc Board: Surface Mount
• Pcb Mount Retention: With
• Pcb Mount Alignment: Without
• Smt Compatible: Yes
• Mount Angle: Right Angle
• Wire/cable Type: Discrete Wire
• Termination Method To Wire/cable: Poke-in
• Ul File Number: E28476
• Keyed: No
• Contact Current Rating, Max (a): 4
• Operating Voltage (vac): 250
• Operating Voltage (vdc): 250
• Wire/cable Size (awg): 18 – 22
• Tool-less Wire Termination: Yes
• Tail Orientation: In-line
• Profile Height (y-axis) (mm [in]): 3.90 [0.154]
• Number Of Positions: 1
• Number Of Rows: 1
• Length (x-axis) (mm [in]): 14.22 [0.560]
• Width (z-axis) (mm [in]): 3.95 [0.156]
• Post-mating Assembly Measurement (mm [in]): 10.5 [0.413]
• Mating Retention: Without
• Header Mating Direction: Horizontal
• Pcb Mount Retention Type: Solder Pads
• Preloaded: Yes
• Tail Plating Material: Matte Tin over Nickel
• Tail Plating, Thickness (µm [?in]): 3 [118.11]
• Contact Type: Socket
• Contact Plating, Mating Area, Material: Matte Tin
• Contact Plating, Mating Area, Thickness (µm [?in]): 3 [118]
• Stamped And Formed: Yes
• Connector Style: Receptacle
• Mating Alignment: Without
• Housing Color: White
• Ul Flammability Rating: UL 94V-0
• Pre-designed Cables Available: No
• Agency/standard: CSA, UL
• Agency/standard Number: C22.2 No. 182.3-M1987, UL 1977
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Reflow solder capable to 245°C, Reflow solder capable to 260°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Circuit Identification Feature: Without
• Operating Temperature (°c [°f]): -40 – +105 [-40 – +221]
• Applies To: Printed Circuit Board, Wire/Cable
• Uv Exposure Rated: No
• Glow Wire Rating: No
• Accepts Wire Insulation Diameter, Range (mm [in]): 2.10 [0.0826]
• Smt Soldering Temperature (°c [°f]): 220 [428]
• Lighting Interconnect Level: Level 2
• Application Use: Wire-to-Board
• Packaging Method: SMT Pocket Tape

Rev B
Mechanical shock.
Wire insertion force.
Wire retention force.
Thermal shock.
Humidity/temperature cycling.
Temperature life.
NOTE
Test Description
Shall meet visual requirements, show no physical damage, and meet requirements of additional
tests as specified in the Product Qualification and Requalification Test Sequence shown in Figure
2.
No discontinuities of 1 microsecond
or longer duration.
See Note.
15.6 N [3.5 lbf] maximum for solid
wire.
29.9 N [6.5 lbf] maximum for
prebond and stranded wire.
53.4 N [12 lbf] minimum for solid
wire.
22.2 N [5 lbf] minimum for prebond
and stranded wire.
See Note.
See Note.
See Note.
ENVIRONMENTAL
Figure 1 (end)
Requirement
EIA-364-27, Condition H.
Subject mated specimens to 30 G's
half-sine shock pulses of 11
milliseconds duration. Three shocks
in each direction applied along 3
mutually perpendicular planes, 18
total shocks.
See Figure 3.
EIA-364-13.
Measure force necessary to insert
wires at a maximum rate of 12.7
mm [.5 in] per minute.
EIA-364-13.
Measure force necessary to extract
wire at a maximum rate of 12.7 mm
[.5 in] per minute.
EIA-364-32, Test Condition VII.
Subject specimens to 25 cycles
between -40 and 105°C.
EIA-364-31, Method III.
Subject specimens to 10 cycles (10
days) between 25 and 65°C at 80
to 100% RH.
EIA-364-17, Method A, Test
Condition 4.
Subject specimens to 105°C for
648 hours.
Procedure
108-2284
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