353293-6 TE Connectivity, 353293-6 Datasheet - Page 6

• Manufacturer Part Number: 353293-6
• Description: WIRE-BOARD CONN, RECEPTACLE, 6POS, 1.5MM
• Manufacturer: TE Connectivity
• Series: Mini CTr

Specifications of 353293-6

• Connector Type: Wire To Board
• Contact Termination: IDC / IDT
• Gender: Receptacle
• No. Of Contacts: 6
• No. Of Rows: 1
• Pitch Spacing: 1.5mm
• Contact Plating: Tin
• Rohs Compliant: Yes
• Product Type: Connector
• Termination Method To Wire/cable: IDC
• Sealed: No
• Ul File Number: E28476
• Csa File Number: LR 7189-133
• Contact - Rated Current (a): 2
• Operating Voltage Reference: AC/DC, AC, DC
• Operating Voltage (vac): 50
• Operating Voltage (vdc): 50
• Wire/cable Size (awg): 26 – 28
• Profile Height (y-axis) (mm [in]): 6.00 [0.236]
• Number Of Positions: 6
• Number Of Rows: 1
• Centerline (mm [in]): 1.50 [0.059]
• Mating Retention: With
• Length (x-axis) (mm [in]): 10.50 [0.413]
• Width (z-axis) (mm [in]): 3.60 [0.141]
• Contact Type: Socket
• Contact Plating, Mating Area, Material: Pre-Tin
• Contact Plating, Mating Area, Thickness (µm [?in]): 0.2 [7.87]
• Contact Design: Dual Beam
• Mating Alignment: With
• Housing Color: Gray
• Ul Flammability Rating: UL 94V-0
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Not relevant for lead free process
• Rohs/elv Compliance History: Always was RoHS compliant
• Agency/standard: UL, CSA
• Operating Temperature (°c [°f]): -30 – +105 [-22 – +221]
• Applies To: Wire/Cable
• Accepts Wire Insulation Diameter, Range (mm [in]): 0.80 – 0.95 [0.030 – 0.037]
• Application Use: Wire-to-Board, Wire-to-Board / Wire-to-Wire / Wire-to-Panel, Wire-to-Panel, Wire-to-Wire
• Contact Transmits (typical Application): Signal (Data)
• Pick And Place Cover: Without
• Packaging Method: Bag, Box

ASHL-0005- ES REV B
3.8.13 Vibration
3.8.14 Physical Shock
3.8.15 Hammerring Shocks
3.8.16 Solderability
Para.
(Low Frequency)
Test Items
AMP Shanghai Ltd.
Tyco Electronics
No electrical discontinuity
greater than 1 µsec. Shall occur.
20 mΩ Max. (Final)
No electrical discontinuity
greater than 1µsec. Shall occur.
20 mΩ Max.(Final)
No electrical discontinuity
greater than 1µsec.shall occur.
20 mΩ Max.(Final)
Wet Solder Coverage :
90 % Min.
Fig. 2 (To be continued)
Requirements
6 of 17
PAGE
Document No.
108-5525
Subject mated connectors to 10-55-10
Hz traversed in 1 minute at 1.52 mm
amplitude 2 hours each of 3 mutually
perpendicular planes.
10 mA applied.
MIL-STD-202 TEST METHOD 201
CONDITION A
IEC 68-2-6
Mounting : Fig. 9
Accelerated Velocity :
490 m/s
Waveform: halfsine shock pulse
Duration : 11 msec.
Number of Drops : 3 drops each to
normal and reversed directions of X,
Y and Z axes, totally 18 drops. 10
mA DC applied.
MIL-STD-202 TEST METHOD 213
CONDITION A
IEC 68-2-27
Mounting : Fig. 9
Under 10000 cycles of repeated
hammering shocks of the condition as
shown Fig.10,with the test current of
1mA at 10VDC applied to the circuit
as shown in Fig.11.
During the test, the circuit shall be
monitored for fluctuation of electrical
resistance.
Solder Temperature : 230 ± 5 °C
Immersion Duration :3 ± 0.5 seconds
Flux : Alpha 100
(NON-active rosin base)
2
( 50 G)
Procedures
REV
A
LOC
ES