AD5504BRUZ Analog Devices Inc, AD5504BRUZ Datasheet - Page 15

• Manufacturer Part Number: AD5504BRUZ
• Description: IC DAC 12BIT SPI 16-TSSOP
• Manufacturer: Analog Devices Inc

Specifications of AD5504BRUZ

• Data Interface: SPI™, QSPI™, MICROWIRE™, and DSP
• Design Resources: Powering a 30V DAC from a 3V supply (CN0193)
• Settling Time: 45µs
• Number Of Bits: 12
• Number Of Converters: 4
• Voltage Supply Source: Single Supply
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP
• Resolution (bits): 12bit
• Input Channel Type: Serial
• Supply Voltage Range - Analogue: 10V To 62V
• Supply Voltage Range - Digital: 2.3V To 5.5V
• Supply Current: 2mA
• Digital Ic: RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power Dissipation (max): -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

LDAC FUNCTION
The DAC outputs can be updated using the hardware LDAC
pin. LDAC is normally high. On the falling edge of LDAC, data
is copied from the input registers to the DAC registers, and the
DAC outputs are updated simultaneously (asynchronous update
mode, see Figure 3). If the LDAC is kept low, or is low on the
falling edge of the 16
DAC output are updated automatically (synchronous update
mode, see Figure 3).
TEMPERATURE SENSOR
The AD5504 has an integrated temperature sensor that causes
the part to enter thermal shutdown mode when the temperature
on the die exceeds 110°C. In thermal shutdown mode, the
analog section of the device powers down and the DAC outputs
are disconnected, but the digital section remains operational,
which is equivalent to setting the power-down bit in the control
register. To indicate that the AD5504 has entered temperature
shutdown mode, Bit 0 of the control register is set to 1 and the
ALARM pin goes low. The AD5504 remains in temperature
shutdown mode with Bit 0 set to 1 and the ALARM pin low, even
if the die temperature falls, until Bit 0 in the control register is
cleared to 0.
th
SCLK, the appropriate DAC register and
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POWER DISSIPATION
Drawing current from any of the voltage output pins causes a
temperature rise in the die and package of the AD5504. The
package junction temperature (T
normal operation. If the die temperature exceeds 110°C, the
AD5504 enters thermal shutdown mode as described in the
previous section. The amount of heat generated can be
calculated using the formula
where:
T
T
P
θ
Absolute Maximum Ratings section for this value).
POWER SUPPLY SEQUENCING
The power supplies for the AD5504 can be applied in any order
without affecting the device. However, the AGND and DGND
pins should be connected to the relevant ground plane before
the power supplies are applied. None of the digital input pins
(SCLK, SDI, SYNC, R_SEL and CLR) should be allowed to float
during power up. The digital input pins can be connected to
pull-up (to V
required.
JA
TOTAL
J
A
is the package junction temperature.
is the ambient temperature.
is the thermal impedance of the AD5504 package (see the
T
J
is the total power being consumed by the AD5504.
= T
A
+ (P
LOGIC
TOTAL
) or pull-down (to DGND) resistors as
× θ
JA
)
J
) should not exceed 130°C for
AD5504