AD9706BCPZ Analog Devices Inc, AD9706BCPZ Datasheet - Page 10

IC DAC TX 12BIT 175MSPS 32-LFCSP

AD9706BCPZ

Manufacturer Part Number
AD9706BCPZ
Description
IC DAC TX 12BIT 175MSPS 32-LFCSP
Manufacturer
Analog Devices Inc
Series
TxDAC®r
Datasheet

Specifications of AD9706BCPZ

Settling Time
11ns
Number Of Bits
12
Data Interface
Serial
Number Of Converters
1
Voltage Supply Source
Analog and Digital
Power Dissipation (max)
50mW
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
32-LFCSP
Inl ±
1.48LSB
Update Rate
175MSPS
Output Type
Current
Termination Type
SMD
Supply Voltage Max
3.6V
No. Of Bits
12 Bit
Leaded Process Compatible
Yes
Dnl±
1.17LSB
No. Of Dacs
1
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AD9706-EBZ - BOARD EVAL FOR AD9706
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AD9706BCPZ
Manufacturer:
REALTEK
Quantity:
2 300
Part Number:
AD9706BCPZ
Manufacturer:
ADI/亚德诺
Quantity:
20 000
AD9704/AD9705/AD9706/AD9707
ABSOLUTE MAXIMUM RATINGS
Table 7.
Parameter
AVDD
DVDD
CLKVDD
ACOM
ACOM
DCOM
AVDD
AVDD
DVDD
SLEEP
Digital Inputs, MODE
IOUTA, IOUTB
REFIO, FS ADJ, OTCM
CLK+, CLK–, CMODE
Junction Temperature
Storage Temperature
Lead Temperature
Range
(10 sec)
With
Respect to
ACOM
DCOM
CLKCOM
DCOM
CLKCOM
CLKCOM
DVDD
CLKVDD
CLKVDD
DCOM
DCOM
ACOM
ACOM
CLKCOM
−0.3 V to +3.9 V
−0.3 V to +3.9 V
−0.3 V to +3.9 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−3.9 V to +3.9 V
−3.9 V to +3.9 V
−3.9 V to +3.9 V
−0.3 V to DVDD + 0.3 V
−0.3 V to DVDD + 0.3 V
−0.3 V to AVDD + 0.3 V
−0.3 V to CLKVDD + 0.3 V
Rating
−1.0 V to AVDD + 0.3 V
150°C
−65°C to +150°C
300°C
Rev. A | Page 10 of 52
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
Table 8. Thermal Resistance
Package Type
32-Lead LFCSP_VQ
1
ESD CAUTION
Thermal impedance measurements were taken on a 4-layer board in still air,
in accordance with EIA/JESD51-7.
1
θ
32.5
JA
Unit
°C/W

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