AD421BNZ Analog Devices Inc, AD421BNZ Datasheet - Page 4

• Manufacturer Part Number: AD421BNZ
• Description: IC DAC SNGL 16BIT 16-DIP
• Manufacturer: Analog Devices Inc

Specifications of AD421BNZ

• Data Interface: Serial
• Settling Time: 8µs
• Number Of Bits: 16
• Number Of Converters: 1
• Voltage Supply Source: Single Supply
• Power Dissipation (max): 1.95mW
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Resolution (bits): 16bit
• Sampling Rate: 125SPS
• Input Channel Type: Serial
• Supply Current: 575µA
• Digital Ic Case Style: DIP
• No. Of Pins: 16
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although these devices feature proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
ABSOLUTE MAXIMUM RATINGS*
(T
DRIVE, BOOST, COMP to COM . . . –0.5 V to V
LOOP RTN to COM . . . . . . . . . . . . . . . . . . . –2 V to + 0.5 V
Digital Input Voltage to COM . . . . . . . –0.5 V to V
Operating Temperature Range
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Plastic DIP Package, Power Dissipation . . . . . . . . . . 670 mW
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW
*
AD421
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
A
Commercial (B Version) . . . . . . . . . . . . . . – 40°C to +85°C
θ
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . . 260°C
θ
Lead Temperature, Soldering
= +25°C unless otherwise noted)
JA
JA
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 116°C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 110°C/W
CC
CC
+ 0.5 V
+ 0.5 V
–4–
Model
AD421BN
AD421BR
AD421BRRL
EVAL-AD421EB
*N = Plastic DIP, R = SOIC.
LOOP RTN
REF OUT1
REF OUT2
CLOCK
PIN CONFIGURATION
LATCH
REF IN
DATA
ORDERING GUIDE
LV
Temperature
Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Evaluation Board
DIP and SOIC
1
2
3
4
5
6
7
8
(NOT TO SCALE)
AD421
TOP VIEW
WARNING!
16
15
14
13
12
11
10
9
V
BOOST
COMP
DRIVE
C1
C2
C3
COM
CC
Package
Option
N-16
R-16
R-16; Reeled SOIC
ESD SENSITIVE DEVICE
*
REV. C