SC2200UFH-266B D3 AMD (ADVANCED MICRO DEVICES), SC2200UFH-266B D3 Datasheet - Page 390
SC2200UFH-266B D3
Manufacturer Part Number
SC2200UFH-266B D3
Description
Manufacturer
AMD (ADVANCED MICRO DEVICES)
Datasheet
1.SC2200UFH-266B_D3.pdf
(429 pages)
Specifications of SC2200UFH-266B D3
Operating Temperature (min)
0C
Operating Temperature (max)
85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Lead Free Status / Rohs Status
Not Compliant
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Notes:
1)
2)
408
IDE_CS[1:0]#
IDE_DATA[15:0]
IDE_DATA[15:0]
IDE_DREQ0
IDE_DACK0#
IDE_IOR0#
IDE_IOW0#
For Multiword DMA transfers, the Device may negate IDE_DREQ[0:1] within the tL specified time once IDE_DACK[0:1
is asserted, and reassert it again at a later time to resume the DMA operation. Alternatively, if the device is able to co
tinue the transfer of data, the device may leave IDE_DREQ[0:1] asserted and wait for the host to reasse
IDE_DACK[0:1]#.
This signal can be negated by the host to Suspend the DMA transfer in process.
32580B
Figure 9-26. Multiword DMA Data Transfer Timing Diagram
t
t
M
I
t
E
t
G
t
D
t
G
t
F
t
H
t
K
t
0
t
L
AMD Geode™ SC2200 Processor Data Book
t
N
t
j
t
Z
Electrical Specifications
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