FW82546GB S L75S Intel, FW82546GB S L75S Datasheet - Page 42

• Manufacturer Part Number: FW82546GB S L75S
• Manufacturer: Intel

Specifications of FW82546GB S L75S

• Operating Supply Voltage (typ): 1.5/2.5/3.3V
• Operating Supply Voltage (min): 1.43/2.38/3V
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 364
• Lead Free Status / Rohs Status: Not Compliant

82546GB — Networking Silicon
6.2
36
Figure 15. 82546GB 364-Lead BGA Ball Pad Dimensions
Package Information
The 82546GB device is a 364-lead ball grid array (BGA) measuring 21 mm
dimensions are detailed in the figures below. The nominal ball pitch is 1 mm.
0.50 mm +/- 0.05 mm
Solder Mask Opening
0.65 mm +/- 0.05 mm
Pad Size
Detail Area
2
. The package
Datasheet