TLE5010-L Infineon Technologies, TLE5010-L Datasheet

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TLE5010-L

Manufacturer Part Number
TLE5010-L
Description
Manufacturer
Infineon Technologies
Datasheet

Specifications of TLE5010-L

Lead Free Status / Rohs Status
Compliant
Preliminary Data Sheet, V 0.91, January 2008
TLE5010
GMR-Based Angular Sensor
S e n s o r s

Related parts for TLE5010-L

TLE5010-L Summary of contents

Page 1

... Preliminary Data Sheet, V 0.91, January 2008 TLE5010 GMR-Based Angular Sensor ...

Page 2

... Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies failure of such components can reasonably be expected to cause the failure of that life-support device or system affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body support and/or maintain and sustain and/or protect human life ...

Page 3

... TLE5010 Preliminary Data Sheet Revision History: Previous Version: Page Subjects (major changes since last revision) General Spelling and typing errors corrected 51 Molding Compound removed 52 Package Outline Figure modified 53 Marking changed We Listen to Your Comments Is there any information in this document that you feel is wrong, unclear or missing? Your feedback will help us to continuously improve the quality of this document ...

Page 4

... Angle Calculation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 5.5.1 Components of the Output Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 5.5.2 GMR Error Compensation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Temperature-Dependent Offset Value . . . . . . . . . . . . . . . . . . . . . . . . 20 Offset Correction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Amplitude Normalization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Non-Orthogonality Correction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Resulting Angle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 5.6 GMR Parameters after Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 6 Signal Processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 7 Clock Supply (CLK Timing Definition Preliminary Data Sheet 4 TLE5010 V 0.91, 2008-01 ...

Page 5

... Internal Supply Voltage Comparators . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 12.2 V Overvoltage Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 DD 12.3 GND–Off Comparator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 12.4 V –Off Comparator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Typical Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 13.1 Angle Sensor System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 14 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 14.1 Package Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 Package Outline PG-DSO Footprint PG-DSO Packing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Preliminary Data Sheet ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 off DATW TLE5010 V 0.91, 2008-01 ...

Page 6

... Automotive qualified: -40°C to +150°C (Junction Temperature) • Latch up immunity according JEDEC standard • ESD > (HBM) • Green package with lead-free (Pb-free) plating Type Marking TLE5010 5010-2 Preliminary Data Sheet field sensing for angle Ordering Code TBD 6 TLE5010 Package PG-DSO-8 V 0.91, 2008-01 ...

Page 7

... General Angular Sensing 1.3 Product Description The TLE5010 is a 360° angle sensor that detects the orientation of a magnetic field. This is achieved by measuring sine and cosine angle components with monolithic integrated Giant Magneto Resistance (GMR) elements. Data communications are accomplished with a bi-directional SSC Interface that is SPI compatible ...

Page 8

... TST2 Preliminary Data Sheet In/Out Function I Chip Clock I SSC Clock I SSC Chip Select I/O SSC Data, open drain I/O Test Pin 1, must be connected to GND - Supply Voltage - Ground I/O Test Pin 2, must be connected to GND 8 TLE5010 Overview 5 Center of Sensitive Area 4 V 0.91, 2008-01 ...

Page 9

... TST1 TST2 Figure 2 Block Diagram Preliminary Data Sheet VDD_OV TST1 Comp VRA VRA_OV VRA_Rst Temperature Sensor A Comb Filter Comb D Filter 1 TLE5010 9 TLE5010 VDD VDD-off CLK Comp SCK SSC VRD VRD_OV VRD_Rst XH FIR XL Filter 16 16 Control FSYNC FCNT FSM 16 16 FIR YH Filter ...

Page 10

... Internal Power Supply The internal stages of the TLE5010 are supplied with different voltage regulators. • GMR Voltage Regulator VRG • Analog Voltage Regulator VRA • Digital Voltage Regulator VRD Each voltage regulator has its own overvoltage and undervoltage detection circuits. ...

Page 11

... GMR Functionality The GMR sensor is implemented using vertical integration. This means that the GMR active areas are integrated above the logic portion of the TLE5010 device. GMR elements change their resistance depending on the direction of the magnetic field. Four individual GMR elements are connected to one Wheatstone Sensor Bridge. These GMR elements sense one of two components of the applied magnetic field: • ...

Page 12

... Because only the relative values influence the result, the absolute size of the two signals is of minor importance. Therefore, most influences to the amplitudes are compensated. V 0° Figure 4 Ideal Output of the GMR Sensor Preliminary Data Sheet Y Component (SIN 90° 180° 12 TLE5010 X Component (COS) V (COS) X 270° 360° Angle α V (SIN 0.91, 2008-01 General ...

Page 13

... Preliminary Data Sheet Symbol Limit Values min. max. V -0.5 6 6.5 -0 -40 150 |125| - |80| 13 TLE5010 Absolute Maximum Ratings Unit Notes V max lifetime 0.35 V may DD not be exceeded °C mT max 5 min 25°C A max 25° 0.91, 2008-01 ...

Page 14

... Operating Range The operating conditions identified in correct operation of the TLE5010. All parameters specified in the following sections refer to these operating conditions, unless otherwise noticed. Table 3 Operating Range Parameter Symbol V Supply Voltage DD I Output Current Q V Input Voltage IN B Magnetic Induction XY Ang Angle Range ...

Page 15

... V -0. +0. “Signal Processing” on Page 15 TLE5010 V = 5.0 V and 25° < 150°C J Unit Notes 4 Power On Reset µs > & after DD DDmin f first edge on CLK 3) ns short term 4) long term digits 1 σ @ FIR_BYP = 0 1 σ ...

Page 16

... Electrical and Magnetic Parameters min. typ. max -10 - -150 15 - 225 15 - 225 10 - 150 - - 0 0.4 V < 5 Symbol Limit Values min. max. ± HBM ± 500 V - CDM 16 TLE5010 Unit Notes V CS µA , DATA µA SCK, CLK TST1 TST2 Unit Notes 1) kV HBM 2) V CDM = 25° 0.91, 2008-01 ...

Page 17

... Y -10.0 0 10.0 -5000 - 5000 COS MAX MIN +A 90° 180° Offset -A 17 Unit Notes digits @ Calibration Conditions Operating Range % @ Calibration Conditions digits @ Calibration Conditions ° @ Calibration Conditions digits without magnet 270° 360° Angle V 0.91, 2008-01 TLE5010 4) ...

Page 18

... Electrical and Magnetic Parameters + X X MAX --------------------------------- = MAX -------------------------------- - = – MAX -------------------------------- - = – MAX -------------------------------- = tco_d_x tco_k_x tco_d_y tco_k_y OY Symbol Limit Values min. typ. tco_d_x - +0.116296 tco_d_y - -0.079401 tco_k_x - -0.0010147 tco_k_y - -0.0010121 18 MIN MIN MIN MIN × X25 × Y25 Unit max. - digits_/ 1_/ 0.91, 2008-01 TLE5010 Notes ...

Page 19

... Table 9 GMR Calibration Conditions Parameter Symbol Limit Values B Flux density CAL T Temperature CAL Preliminary Data Sheet Electrical and Magnetic Parameters ϕ ϕ ϕ = – Table 9. of the temperature measurement path at the calibration min. typ. max TLE5010 Unit Notes °C V 0.91, 2008-01 ...

Page 20

... Preliminary Data Sheet Electrical and Magnetic Parameters × ( α ϕ = cos + × ( α ϕ = sin + Amplitude sin) Signal Offset sin) Signal Y ϕ : Phase error sin) Signal × ------------- - = + O X X25 × ------------- - = + O Y Y25 and can be described – – “Temperature V 0.91, 2008-01 TLE5010 ...

Page 21

... After correction of all errors, the resulting angle can be calculated using the arctan 1) function . 1) Microcontroller function “arctan2(Y Preliminary Data Sheet Electrical and Magnetic Parameters = – – ------ = ------ = × – – sin ------------------------------------------ - = Y 3 – ϕ cos Y   3 α ------ = arc tan –   )” to resolve 360° TLE5010 ϕ ϕ 0.91, 2008-01 ...

Page 22

... Overall Error err 1) At 25°C, B=30mT 2) Including hysteresis error Preliminary Data Sheet Electrical and Magnetic Parameters = 0 mT and the operating conditions given in Z 14. Limit Values min. typ 0.7 22 TLE5010 Table 9 "GMR Calibration Table Unit Notes max 2,0 ° V 0.91, 2008-01 10. The Table 3 ...

Page 23

... One digit represent typically 5.166 µV. 6) Correspond to max. GMR output value. Preliminary Data Sheet 1) min. typ. - 4.9 19.6 - 81,9 - 20,5 - 163 Signal Processing Unit Notes max. - kHz FIR_BYP=0 FIR_BYP=1 - µs FIR_BYP=0 - FIR_BYP=1 - FIR_BYP=0 - FIR_BYP=1 23230 digits signed 16-bit integer (2s complement 0.91, 2008-01 TLE5010 4) 5) ...

Page 24

... Preliminary Data Sheet Clock Supply (CLK Timing Definition) t CLK t CLKl Limit Values min. typ. max. 3.9 4.00 4 DUTY - - 100 - - with t CLK(f_min) CLK(f_min with t CLK(f_min) CLKh(f_max) 24 TLE5010 t CLKh(f_min Unit Notes MHz % V ns from from H f MHz * 25 CLK MHz ( ( CLK(f_min CLK(f_min) CLKl(min) V 0.91, 2008- ...

Page 25

... Synchronous Serial Communication Interface typ. 1k Ω *) DATA *) SCK *) CS *) optional , e.g. 100 Ω MRST *) MTSR optional *) SCK *) CS *) optional , e.g. 100 Ω 25 TLE 501x (SSC Slave) *) DATA Shift Register SCK CS TLE 501x (SSC Slave) typ. 1kΩ *) DATA Shift Register SCK CS V 0.91, 2008-01 TLE5010 ...

Page 26

... SSC Inactive Time (CS off The SSC inactive time defines the delay time after a transfer before the TLE5010 can be selected again. The TLE5010 reacts to only one command after SSC inactive time. Then, the SSC Interface of the TLE5010 is disabled until the next SSC Inactive Time is present ...

Page 27

... Synchronous Serial Communication Interface Table 12 "CLK Timing Specification" on Page 24 min. typ. max 2 DIG DIG t 10 DIG DIG DIG - +10 DIG DIG - +10 DIG DIG + +50 DIG DIG (max) CLK TLE5010 Unit Notes MBit / SSC inactive time SSC_FILT = 0 SSC_FILT = Falling edge 0.91, 2008-01 4) ...

Page 28

... Synchronous Serial Communication Interface t t SCKl MIN SCKh t DATw MIN Wr t DATw MAX t DATr MIN t DATr MAX t DATw MIN Wr t DATw MAX t DATr MIN t DATr MAX 28 TLE5010 t PU Earliest sample timepoint Earliest sample timepoint of second sample from filter Rd V 0.91, 2008-01 ...

Page 29

... The margin time shown in Line and the earliest possible sample read of the TLE5010 itself for read back useful to have a maximum distance between the WRITE and subsequent READ. This ensures a reliable read back of the written data for the Slave-Active Byte generation. Table 14 ...

Page 30

... The following conditions apply: • The DATA pin has a ’2-of-3’ filter. • The CS input has a ’2-of-3’ filter, which suppresses only positive spikes. Preliminary Data Sheet Synchronous Serial Communication Interface 1 -------------- - = DIGIT SCK fall detected Masked, because no fall detected 30 TLE5010 V 0.91, 2008-01 ...

Page 31

... MSB DATA Command Byte SSC-Master is driving DATA (µC) Figure 12 SSC Data Transfer (Data Read Example) 8.5 SSC Command Byte The TLE5010 is controlled by a command byte sent first at every data transmission. Table 15 Structure of the Command Byte Name Bits RW [7] ADDR [6..3] ND [2..0] ...

Page 32

... Register Table This chapter defines the complete address range as well as all registers of the TLE5010. It also defines the read/write access rights of the specific registers. the values with symbols. Access to the registers is accomplished via the SSC Interface. Table 16 Address Map Addr. Name Bits ...

Page 33

... In the case of an Update Command and the Update- Mode bit (UR in CTRL1) is set, the immediate values are stored in this Update-Buffer simultaneously. This enables a snapshot of all necessary system parameters at the same time. Reset only after readout Read-only registers Read and write registers 33 TLE5010 Register Table ). H V 0.91, 2008-01 ...

Page 34

... FSYNC and FCNT are reset to 0. Then, the Angle-Test (ANGT_EN) is automatically disabled and switches back to normal operation. Also, the UPDATE bit is toggled W L Update/Run Mode 0: Run Mode (Buffer1 values are immediate values) 1: Update Mode (Buffer2 values are stored values) 34 TLE5010 Register Table AUTO UR - ...

Page 35

... The values in Register 01H to 04H represent one byte of two’s complement signed 16-bit integer values. X_L Addr X_H Addr Y_L Addr Y_H Addr Preliminary Data Sheet Reset Value Low Byte R U Reset Value High Byte R U Reset Value Low Byte R U Reset Value High Byte TLE5010 Register Table 0.91, 2008-01 ...

Page 36

... X,Y data, this counter must be ≥ indicate valid X,Y values overflows, it resets show, that values are still valid. H Note: If FIR_BYP is activated, this counter counts four times faster! 36 TLE5010 Register Table FCNT and OFF after any write to FSYNC and ...

Page 37

... Angle Test Enable 0: Angle Test disable command 1: Angle Test enable command in this case X and Y values represent resistive test values, which can be used to simulate angle values Angle Test X and Y value See: Table 17 "Functional Angle Test" on Page 45 37 TLE5010 Register Table ...

Page 38

... Reserved Registers (08 The values in these registers are 8-bit unsigned integer values. The values in addr.8 and addr.9 must be in reset status. Reserved Addr Reserved Addr Preliminary Data Sheet Reset Value Reserved Reset Value Reserved 38 TLE5010 Register Table 0.91, 2008-01 ...

Page 39

... ADC input switched to TST1,2, ADC selected by 2) TST_CHAN W L GMR switch to TST1and TST2 0: No GMR switch, normal operation 1: GMR switched to TST1 Test Channel select 0: X channel linked to TST1and TST2 1: Y channel linked to TST1and TST2 39 TLE5010 Register Table TST_ CHAN 0.91, 2008-01 ...

Page 40

... R Device Revision (current number TLE5010 productive chip, 1st revision (B11 TLE5010 productive chip, 2nd revision (B21 TLE5010 productive chip, 3rd revision (B31 TLE5010 productive chip, 4th revision (B41) H (Refer to Errata Sheets for later versions) Reset Value LOCK W Type Description W Lock Byte ≠ ...

Page 41

... GMR Voltage Regulator Overvoltage Comparator 0: Voltage ok 1: VRG Overvoltage occurred R S Analog Voltage Regulator Overvoltage Comparator 0: Voltage ok 1: VRA Overvoltage occurred R S Digital Voltage Regulator Overvoltage Comparator 0: Voltage ok 1: VRD Overvoltage occurred W L Slave Number Used in the SSC protocol 41 TLE5010 Register Table V 0.91, 2008-01 ...

Page 42

... A “high” condition on the negated Chip Select pin (CS) of the selected TLE5010 interrupts the transfer immediately. The CRC calculator is automatically reset. • Every access to the TLE5010 with the number of data (ND) ≥ performed with address auto-increment. • After an auto-increment overflow, the addresses begin again from 00 • ...

Page 43

... Slave Active Byte: 1111_1110 Preliminary Data Sheet J1850 Bus-Specification of 15.Feb.1994 for Figure 13) xor xor parallel Remainder Slave Active Byte: 1110_1110 Slave Active Byte: 1101_1101 Slave Active Byte: 1011_1011 Slave Active Byte: 0111_0111 43 TLE5010 Data Communication via SSC . B xor 0.91, 2008-01 Serial CRC output ...

Page 44

... Transmitted Sequence: Command Data CRC 00000001 00000101 10011011 Preliminary Data Sheet CRC (init all ‘0’) 00000000 . . =01100100. Remainder 10011011 inverted Remainder 44 TLE5010 Data Communication via SSC V 0.91, 2008-01 ...

Page 45

... Test Structures Two different test signal structures are implemented in the TLE5010. These are: • Functional Angle Test. In this case, well-known signals feed the ADCs. • Temperature Measurement. This is useful to read out the chip temperature for compensation purposes. 11.1 Functional Angle Tests It is possible to feed the ADCs with appropriate values to simulate a certain magnet- position and other GMR effects ...

Page 46

... Should be used for temperature compensation of offset errors Preliminary Data Sheet Y 122.1% 0% 70.7% Symbol Limit Values min. typ -40 T +2550 +5775 25 T -22000 - 150 S - -188. TLE5010 Test Structures 141.4% X 100.0% Unit Notes max. +22000 digits +9000 digits - digits 1) - dig / K V 0.91, 2008-01 ...

Page 47

... No GMR signal available < t upd t t upd upd Val_A0 Val_A1 Val_G4 Val_A0 No GMR signal available 47 Test Structures t t upd upd 0 1 Val_G0 Val_G1 Val_A1 Val_G0 upd upd upd Updated FCNT Val_G0 Val_G1 Val_G2 Val_A1 Val_G0 Val_G1 automatic! V 0.91, 2008-01 TLE5010 t upd 2 Val_G2 Val_G1 ...

Page 48

... µs V VRx_O V bit. V DDA - 10µs Spike Filter + GND bit. (See Figure 17) 48 TLE5010 Overvoltage Comparators Notes GND_OFF GND TST1 VDD_off CLK SCK DD The error condition must be longer than this value f (min. 256 clocks of DIG and , then this OVG ...

Page 49

... DD The V – Off Comparator detects a disconnection of the V DD case, the TLE5010 is supplied by the SCK, CLK and CS input pins via the ESD structures. It activates the The retriggerable analog monoflop is necessary because of the non-static signal of the CLK and SCK signals. This comparator is also activated if spikes on CLK or SCK achieve the condition: ...

Page 50

... Application Circuit 13.1 Angle Sensor System A complete system may consist of one TLE5010 and a microcontroller. A second TLE5010 may be used for redundancy to increase system reliability. The microcontroller should contain a CORDIC coprocessor for fast angle calculations and flash memory for the calibration data storage. ...

Page 51

... Soldering Moisture Level Lead frame Plating 1) According to Jedec JESD51-7 Preliminary Data Sheet Limit Values Unit min. typ. max. - 150 200 K K K/W MSL 3 Cu194 / OLIN Sn 100% 51 TLE5010 Package Information Notes 1) Junction to Air Junction to Case Junction to Lead 260°C > 7 µm V 0.91, 2008-01 ...

Page 52

... Reference "D" is defined with the center of all 8 pins Figure 21 Package Outline PG-DSO-8 Preliminary Data Sheet B 0.1 0 SEATING M PLANE 1.27 = 3.81 0. CENTER OF SENSITIVE AREA 52 TLE5010 Package Information 0.35 x 45˚ -0.2 C 1.22 ±0.18 A 0.64 ±0.25 6 ±0.2 E 0.2 M Detail A 3) ø0.6 Sensitive Area P-PG-DSO-08-16-S-PO V03 V 0 ...

Page 53

... Line xxx Gxxxx 3rnd Line Processing Note: For processing recommendations, please refer Infineon’s Notes on Processing Preliminary Data Sheet 0.65 1.27 8 6.4 Description See ordering table on page 6 Lot code G .. green, 4-digit .. date code 53 TLE5010 Package Information 0.3 1.75 2.1 V 0.91, 2008-01 ...

Page 54

... Published by Infineon Technologies AG ...

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