AD8317-EVALZ Analog Devices Inc, AD8317-EVALZ Datasheet - Page 18

• Manufacturer Part Number: AD8317-EVALZ
• Manufacturer: Analog Devices Inc

Specifications of AD8317-EVALZ

• Lead Free Status / Rohs Status: Compliant

AD8317
DIE INFORMATION
Table 6. Die Pad Function Descriptions
Pin No.
1
2, 2
3
4
5
6
7
8
DB1
Mnemonic
INHI
COMM
CLPF
VSET
VOUT
TADJ
VPOS
INLO
COMM
Description
RF Input. Nominal input range of −50 dBm to 0 dBm, re: 50 Ω; ac-coupled RF input.
Device Common. Connect both pads to a low impedance ground plane.
Loop Filter Capacitor. In measurement mode, this capacitor sets the pulse response time and video
bandwidth. In controller mode, the capacitance on this node sets the response time of the error
amplifier/integrator.
Setpoint Control Input for Controller Mode or Feedback Input for Measurement Mode.
Measurement and Controller Output. In measurement mode, VOUT provides a decreasing linear-in dB
representation of the RF input signal amplitude. In controller mode, VOUT is used to control the gain of
a VGA or VVA with a positive gain sense (increasing voltage increases gain).
Temperature Compensation Adjustment. Frequency-dependent temperature compensation is set by
connecting a ground-referenced resistor to this pin.
Positive Supply Voltage: 3.0 V to 5.5 V.
RF Common for INHI. AC-coupled RF common.
Device Common. Connect to a low impedance ground plane.
BOND PAD STATISTICS
ALL MEASURMENTS IN MICRONS.
MINIMUM PASSIVATION OPENING: 59 × 59 MIN PAD PITCH: 89
DIE SIZE CALCULATION
ALL MEASURMENTS IN MICRONS.
DIEX (WIDTH OF DIE IN X DIRECTION) = 670
DIEY (WIDTH OF DIE IN Y DIRECTION) = 1325
DIE THICKNESS = 305 MICRONS
BALL BOND SHEAR STRENGTH SPECIFICATION: MINIMUM 15 GRAMS
Figure 39. Die Outline Dimensions
Rev. B | Page 18 of 20
2
2
3
4
1
DB1
X
8
6
7
5
Y