MT47H512M4HG-3:A Micron Technology Inc, MT47H512M4HG-3:A Datasheet - Page 19
![](/photos/31/34/313422/mfg557-60-fbga_sml.jpg)
MT47H512M4HG-3:A
Manufacturer Part Number
MT47H512M4HG-3:A
Description
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Datasheet
1.MT47H512M4HG-3A.pdf
(134 pages)
Specifications of MT47H512M4HG-3:A
Organization
512Mx4
Address Bus
18b
Access Time (max)
450ps
Maximum Clock Rate
667MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
170mA
Pin Count
60
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Compliant
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Packaging
Package Dimensions
Figure 8: 84-Ball FBGA Package (11.5mm x 14mm) – x16
PDF: 09005aef824f87b6
2gbddr2.pdf – Rev. F 12/10 EN
Seating
11.2 CTR
Solder ball
material: SAC305.
Dimensions apply
to solder balls post-
reflow on Ø0.33
NSMD ball
pads.
plane
0.12
84X Ø0.45
Notes:
0.8 TYP
A
A
1. All dimensions are in millimeters.
2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu).
9 8 7
11.5 ±0.15
0.8 TYP
6.4 CTR
3 2 1
0.8 ±0.1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
Ball A1 ID
14 ±0.15
19
0.25 MIN
1.2 MAX
Micron Technology, Inc. reserves the right to change products or specifications without notice.
Ball A1 ID
2Gb: x4, x8, x16 DDR2 SDRAM
© 2006 Micron Technology, Inc. All rights reserved.
Packaging
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