MT48H16M16LFBF-75 IT:G Micron Technology Inc, MT48H16M16LFBF-75 IT:G Datasheet - Page 79

• Manufacturer Part Number: MT48H16M16LFBF-75 IT:G
• Manufacturer: Micron Technology Inc
• Type: Mobile SDRAMr

Specifications of MT48H16M16LFBF-75 IT:G

• Organization: 16Mx16
• Density: 256Mb
• Address Bus: 15b
• Access Time (max): 8/6ns
• Maximum Clock Rate: 133MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: VFBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.95V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 80mA
• Pin Count: 54
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / Rohs Status: Compliant

Figure 48: Self Refresh Mode
PDF: 09005aef834c13d2
256mb_mobile_sdram_y36n.pdf - Rev. I 11/09 EN
Command
BA0, BA1
Address
DQM
CKE
A10
CLK
DQ
High-Z
t CKS
t CMS
Precharge all
active banks
t AS
Single bank
PRECHARGE
All banks
Bank(s)
T0
t CKH
t CMH
t AH
t CK
Note:
1. Each AUTO REFRESH command performs a REFRESH cycle. Back-to-back commands are
t RP
T1
NOP
not required.
t CH
Enter self refresh mode
t CKS
t CL
REFRESH
AUTO
T2
CLK stable prior to exiting
self refresh mode
256Mb: 16 Meg x 16, 8 Meg x 32 Mobile SDRAM
79
(
(
(
(
(
(
(
)
(
)
(
)
(
)
(
)
(
)
(
)
)
)
)
)
)
)
(
(
(
(
(
(
(
(
)
(
)
(
)
(
)
(
)
(
)
(
)
)
)
)
)
)
)
)
(
)
Micron Technology, Inc. reserves the right to change products or specifications without notice.
(Restart refresh time base)
Exit self refresh mode
Tn + 1
NOP
(
(
(
(
(
(
(
(
(
)
(
)
(
)
(
)
(
)
(
)
(
)
)
)
)
)
)
)
)
)
(
(
(
(
(
(
(
(
)
)
)
)
)
)
)
)
(
(
(
(
(
(
(
)
)
)
)
)
)
)
t XSR
SELF REFRESH Operation
To + 1
©2008 Micron Technology, Inc. All rights reserved.
To + 2
REFRESH
AUTO
Don’t Care