EVB8187 Standard Microsystems (SMSC), EVB8187 Datasheet

no-image

EVB8187

Manufacturer Part Number
EVB8187
Description
Manufacturer
Standard Microsystems (SMSC)
Datasheet

Specifications of EVB8187

Lead Free Status / Rohs Status
Supplier Unconfirmed
SMSC EVB8187
The information contained herein is proprietary to SMSC, and shall be used solely in accordance with the agreement pur-
suant to which it is provided. Although the information is believed to be accurate, no responsibility is assumed for inaccu-
racies. SMSC reserves the right to make changes to this document and to specifications and product descriptions at any
time without notice. Neither the provision of this information nor the sale of the described semiconductor devices conveys
any licenses under any patent rights or other intellectual property rights of SMSC or others unless specifically specified
otherwise. The product may contain design defects or errors known as anomalies, including but not necessarily limited to
any which may be identified in this document, which may cause the product to deviate from published specifications.
SMSC products are not designed, intended, authorized or warranted for use in any life support or other application where
product failure could cause or contribute to personal injury or severe property damage. Any and all such uses without
prior written approval of an officer of SMSC will be fully at the risk of the customer. SMSC is a registered trademark of
Standard Microsystems Corporation (“SMSC”).
SMSC DISCLAIMS AND EXCLUDES ANY AND ALL WARRANTIES, INCLUDING WITHOUT LIMITATION ANY AND
ALL IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, TITLE, AND
AGAINST INFRINGEMENT AND THE LIKE, AND ANY AND ALL WARRANTIES ARISING FROM ANY COURSE OF
DEALING OR USAGE OF TRADE. IN NO EVENT SHALL SMSC BE LIABLE FOR ANY DIRECT, INCIDENTAL, INDI-
RECT, SPECIAL, PUNITIVE, OR CONSEQUENTIAL DAMAGES; OR FOR LOST DATA, PROFITS, SAVINGS OR REV-
ENUES OF ANY KIND; REGARDLESS OF THE FORM OF ACTION, WHETHER BASED ON CONTRACT; TORT;
NEGLIGENCE OF SMSC OR OTHERS; STRICT LIABILITY; BREACH OF WARRANTY; OR OTHERWISE; WHETHER
OR NOT ANY REMEDY OF BUYER IS HELD TO HAVE FAILED OF ITS ESSENTIAL PURPOSE, AND WHETHER OR
NOT SMSC HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
www.smsc.com
EVB8187 User
Manual
Revision 0.7 (12-8-06)

EVB8187 Summary of contents

Page 1

... ENUES OF ANY KIND; REGARDLESS OF THE FORM OF ACTION, WHETHER BASED ON CONTRACT; TORT; NEGLIGENCE OF SMSC OR OTHERS; STRICT LIABILITY; BREACH OF WARRANTY; OR OTHERWISE; WHETHER OR NOT ANY REMEDY OF BUYER IS HELD TO HAVE FAILED OF ITS ESSENTIAL PURPOSE, AND WHETHER OR NOT SMSC HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. SMSC EVB8187 EVB8187 User Manual www.smsc.com Revision 0.7 (12-8-06) ...

Page 2

... Ethernet applications. The LAN8187 requires only a single +3.3v supply, and has an integrated +1.8v supply to run the core digital logic. The EVB8187 is a customer evaluation board that interfaces a standard 40 pin MII connector from an existing MAC controller to the SMSC LAN8187 Ethernet PHY, and out to an RJ-45 Ethernet Jack for 10/100 connectivity ...

Page 3

... J2. Note: Standby power can also be applied at +3.3v to TP5 if the regulator VR2 is removed. 2.1.1 3.3 Volt Power Supply The EVB8187 has an on-board step down DC-DC +3.3v power supply regulator (VR2) and uses the +5v input from the MII. 2.2 Configuration This section gives an explanation to the configuration options available on the SMSC EVB8187 ...

Page 4

... Populate R36 Populate R33 Depopulate R35 Depopulate R32 Populate R27 Depopulate R28 LED3 orient up ACTIVE HIGH Populate R28 Depopulate R27 LED3 orient down Populate R25 Depopulate R26 LED1 orient up ACTIVE HIGH Populate R26 Depopulate R25 LED1 orient down www.smsc.com 4 EVB8187 User Manual SMSC EVB8187 ...

Page 5

... EVB8187 User Manual 2.2.2 Boot Mode Configuratino Options There are Three resistors used to bootstrap the PHY into a specific mode. to populate the resistor to configure the PHY into different modes upon bootup/after reset.. Table 3 PHY Address Configuration Resistors MODE2 MODE1 MODE0 R48 R49 ...

Page 6

... AutoMDIX options The LAN8187 supports AutoMDIX on the analog output pins. The EVB8187 supports the option to disable AutoMDIX and to manually select the channel. Jumper J3 is used to manually disable AutoMDIX funcion. Placing a jumper accross J3 will disable AutoMDIX functionality and prevent the automatic switching of the TX* with RX*. Please refer to the LAN8187 datasheet for more information on AutoMDIX function ...

Page 7

... EVB8187 User Manual test points description † TP6 VDDCORE †.VDDCORE is the internal +1.8v regulated output, that needs a 4.7uF and a 0.1uF capaci- tor to decouple the voltage. Table 2.3 Test points from header J2 Header Pin description nRST: active low reset signal 1 from the MII plug or the on board ...

Page 8

... GND[13] COL 28 GND[12] CRS 29 GND[11] +5V[4] 30 GND[10] Table 5 with a description relative to the EVB8187 Table 5 MII 40 PIN DESCRIPTION ACTIVE LEVEL DESCRIPTION Power n/a Ground Plane. Power n/a +5v supply from the MII connector. Converted to +3.3v on the EVB and used to power the LAN8187 PHY and +3.3v rail ...

Page 9

... EVB8187 User Manual DIRECTION RELATIVE TO NAME EVB-LAN8187 RX_ER TX_ER Input/Output TX_CLK TX_EN COL CRS 2.5.3 RJ-45 Ethernet Jack The pinout for the RJ-45 Jack is described in Table 6 RJ-45 Ethernet Jack Pin-out PIN DESCRIPTION 1 TXP: Transmit Positive 2 TXN: Transmit Negative 3 RXP: Receive Positive ...

Page 10

... LAN8187. However, the user must also make sure to populate R51 to change the mode of Pin46 to TX_ER. 2.7 Schematics Page 1 - Title page with block diagram. Page 2 - Board Stackup. Page 3 - LAN8187 and Magnetics. Page 4 - Power and Miscellaneous. Revision 0.7 (12-8-06) www.smsc.com 10 EVB8187 User Manual SMSC EVB8187 ...

Page 11

LAN8187(I) MII Customer Evaluation Board D Design Details Board: PCB-7058AZ-B Chip: LAN8187I Board Form Factor: Assembly: C EVB BLOCK DIAGRAM B MII LV MII or RMII Bus CONNECTOR RXCLK Default: MII mode RXCLK Not connected to CLK/XTAL RMII mode ...

Page 12

D C stackup B silkscreen (top) soldermask (top) layer copper .0014) prepreg .010 layer 2 Ground plane (1 oz copper .0014) C-stage Core .039 Layer 3 Power plane (1 oz copper .0014) prepreg .010 layer 4 ...

Page 13

Configuration Options R61: Pullup to VDDIO on MDIO serial line. Normally pulled high in the system by the MAC. FB5 FB5 FB1 FB1 F-BEAD F-BEAD F-BEAD F-BEAD 500mA / 0.1DCR 500mA / 0.1DCR 500mA / 0.1DCR 500mA / 0.1DCR ...

Page 14

D VDDIO Note: when connecting to "Variable IO MII" boards the Ferrite Bead FB6 can be populated to provide VDDIO voltage accross the MII connector. FB6 FB6 DNP DNP P1 P1 F-BEAD F-BEAD 500mA / 0.1DCR 500mA / 0.1DCR ...