EVB8187 Standard Microsystems (SMSC), EVB8187 Datasheet - Page 12

• Manufacturer Part Number: EVB8187
• Manufacturer: Standard Microsystems (SMSC)

Specifications of EVB8187

• Lead Free Status / Rohs Status: Supplier Unconfirmed

D
C
B
A
5
5
stackup
silkscreen (top)
soldermask (top)
layer 1 (1 oz copper .0014)
prepreg .010
layer 2 Ground plane (1 oz copper .0014)
C-stage Core .039
Layer 3 Power plane (1 oz copper .0014)
prepreg .010
layer 4 (1 oz copper .0014)
soldermask (bottom)
Silkscreen (bottom)
4
4
NOTES:
1. BOARD FABRICATION AND QUALITY ACCEPTANCE PER IPC-6012 CLASS
2. MATERIAL: NEMA GRADE STANDARD FR4. LAMINATED SHEET, HTE 1 OZ
3. BOARD FABRICATION SHALL APPLY DATE CODE, FABRICATOR'S CAGE
4. SOLDERMASK,USING TYPEB,PHOTO IMAGEABLE LPI FILM 0.0015 THICK.
5. FINISH: SOLDER MASK OVER BARE COPPER (SMOBC), HOT AIR LEVEL DEPOSIT
6. DRILL BOARDS USING DRILL DATA, DRILL PATTERN AND HOLE
7. MINIMUM ANNULAR RINGS:
8. ALL EXPOSED SURFACE LANDS AND LINES TO BE SOLDER COATED.
9. ALL HOLES ARE PLATED THROUGH UNLESS NOTED OTHERWISE.
10. COMPONENT MARKINGS: SILKSCREEN BOTH SIDES USING NON-
11. DIMENSIONS ARE AFTER ETCHING AND PLATING AND ARE BASIC
12. BARE BOARD ELECTRICAL TEST: BARE BOARDS SHALL BE ELECTRICALLY
2. BOARD MUST MEET OR EXCEED QUALIFICATION TESTING AND
QUALITY CONFORMACE TESTING INSPECTION SPECIFIED WITHIN.
COPPER CLAD, TYPE GF/GFG WOVEN GLASS BASE, FLAME RESISTANCE
MEETING UL94V-0 OR BETTER. MATERIAL IN ACCORDANCE WITH IPC-4101.
CODE, I.D. AND UL MARKING TO SECONDARY SIDE WHERE INDICATED.
MARKING PREFERABLY COPPER ETCHED. EPOXY INK ACCEPTABLE.
APPLY TO BOTH SIDES IN ACCORDANCE WITH IPC-SM-840 (TYPE B CLASS 3).
USE APPROPIATE SOLDER MASK ARTWORK FOR EACH SIDE. PUNCTURING OF
PUNCTURING OF TENTED HOLES IS PERMISSIBLE. SOLDERMASK MISREGISTRATION
SHALL NOT EXCEED .004 INCH. SOLDERMASK OVERLAP PERMITTED ON CIRCULAR
LANDS ONLY AND SHALL NOT EXCEED 0.001 INCH. NO OVERLAP PERMITTED
ON RECTANGULAR LANDS.
SCHEDULE. HOLE LOCATION MAY VARY WITHIN .004 IN. MAX
ABOUT TRUE POSITION.
.002 IN MINIMUM - EXTERNAL LAYERS.
.001 IN MINIMUM - INTERNAL LAYERS.
MINIMUM COPPER PLATING IN PLATED HOLES TO BE .001 IN.
COPPER PLATING IN TENTED HOLES SHALL NOT PLUG HOLES WITHOUT
PERMISSION FROM SMSC.
CONDUCTIVE WHITE EPOXY INK. LANDS AND EXPOSED PLATED
AREAS TO BE FREE OF INK.
UNLESS OTHERWISE INDICATED.
TESTED USING CAD GENERATED NET LIST DATA. THIS INFORMATION
TO BE SUPPLIED IN IPC-D-356 FORMAT. ELECTRICAL TESTING SHALL
FOLLOW THE GUIDELINES EXTABLISHED BY IPC-ET-652. GUIDELINES
AND REQUIREMENTS FOR ELECTRICAL TESTING OF PRINTED WIRING
BOARDS.
3
3
2
2
Title
Title
Title
Size
Size
Size
Date:
Date:
Date:
C
C
C
LAN8187(I) MII EVB
LAN8187(I) MII EVB
LAN8187(I) MII EVB
Document Number
Document Number
Document Number
Wednesday, August 02, 2006
Wednesday, August 02, 2006
Wednesday, August 02, 2006
SCH-7058AZ
SCH-7058AZ
SCH-7058AZ
1
1
Sheet
Sheet
Sheet
3930 East Ray Road
3930 East Ray Road
3930 East Ray Road
Suite 200
Suite 200
Suite 200
Phoenix, Arizona 85044
Phoenix, Arizona 85044
Phoenix, Arizona 85044
480-759-0200
480-759-0200
480-759-0200
2
2
2
of
of
of
4
4
4
Rev
Rev
Rev
B
B
B
D
C
B
A