54ACQ245LMQB. National Semiconductor, 54ACQ245LMQB. Datasheet - Page 14

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54ACQ245LMQB.

Manufacturer Part Number
54ACQ245LMQB.
Description
Manufacturer
National Semiconductor
Datasheet

Specifications of 54ACQ245LMQB.

Lead Free Status / Rohs Status
Not Compliant
DSCC FORM 2234
APR 97
4.4.1 Group A inspection.
4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table II herein.
4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883:
c.
d.
a. Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
b.
c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
a. Tests shall be as specified in table II herein.
b. Ground and V
DEFENSE SUPPLY CENTER COLUMBUS
qualification, after process or design changes which may affect the performance of the device, and any changes to the
test fixture. V
shall be guaranteed, if not tested, to the limits established for the worst case outputs. The worst case outputs tested
are to be determined by the manufacturer. Test 5 devices assembled in the worst case package type supplied to this
document. All other package types shall be guaranteed, if not tested, to the limits established for the worst case
package. The package type to be tested shall be determined by the manufacturer. The device manufacturer will
submit to DSCC-VA data that shall include all measured peak values for each device tested and detailed oscilloscope
plots for each V
both a switching output and the output under test.
Each device manufacturer shall test product on the fixtures they currently use. When a new fixture is used, the device
manufacturer shall inform DSCC-VA of this change and test the 5 devices on both the new and old test fixtures. The
device manufacturer shall then submit to DSCC-VA data from testing on both fixtures that shall include all measured
peak values for each device tested and detailed oscilloscope plots for each V
sample part per function. The plot shall contain the waveforms of both a switching output and the output under test.
For V
group shall be composed of function types, that by design, will yield the same test values when tested in accordance
with table I, herein. The device manufacturer shall set a functional group limit for the V
The device manufacturer may then test one device function from a functional group to the limits and conditions
specified herein. All other device functions in that particular functional group shall be guaranteed, if not tested, to the
limits and conditions specified in table I, herein. The device manufacturer shall submit to DSCC-VA the device
functions listed in each functional group and the test results, along with the oscilloscope plots, for each device tested.
C
capacitance. C
C
and C
For device class M, subgroups 7 and 8 tests shall be sufficient to verify the truth table in figure 2 herein. The test
vectors used to verify the truth table shall, at a minimum, test all functions of each input and output. All possible input
to output logic patterns per function shall be guaranteed, if not tested, to the truth table in figure 2, herein. For device
classes Q and V, subgroups 7 and 8 shall include verifying the functionality of the device.
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify
the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method
1005 of MIL-STD-883.
T
A
IN
PD
, C
= +125°C, minimum.
MICROCIRCUIT DRAWING
COLUMBUS, OHIO 43218-3990
shall be tested in accordance with the latest revision of JEDEC Standard No. 20 and table I herein. For C
OHP
I/O
PD
, and C
, test all applicable pins on five devices with zero failures.
, V
OHV
STANDARD
OLP
CC
, V
PD
IN
OLP
bounce tests are required for all device classes. These tests shall be performed only for initial
, V
OLP
and C
shall be measured only for initial qualification and after process or design changes which may affect
, V
OLV
, and V
OLV
, V
OUT
, V
OHP
OHP
shall be measured between the designated terminal and GND at a frequency of 1 MHz.
OLV
, and V
, and V
, a device manufacturer may qualify devices by functional groups. A specific functional
OHV
OHV
shall be measured for the worst case outputs of the device. All other outputs
from one sample part per function. The plot shall contain the waveforms of
SIZE
A
REVISION LEVEL
OLP
, V
OLV
B
, V
OHP
OHP
, V
, and V
OHV
, V
OLP
OHV
SHEET
5962-92177
, and V
from one
14
OLV
IN
, C
tests.
I/O
,

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