TDA7052N2 NXP Semiconductors, TDA7052N2 Datasheet

TDA7052N2

Manufacturer Part Number
TDA7052N2
Description
Manufacturer
NXP Semiconductors
Datasheet
1.TDA7052N2.pdf (8 pages)

Specifications of TDA7052N2

Operational Class
Class-AB
Audio Amplifier Output Configuration
1-Channel Mono
Output Power (typ)
1.2x1@8OhmW
Audio Amplifier Function
Speaker
Total Harmonic Distortion
0.2@8Ohm@100mW%
Single Supply Voltage (typ)
6V
Dual Supply Voltage (typ)
Not RequiredV
Power Supply Requirement
Single
Rail/rail I/o Type
No
Power Supply Rejection Ratio
50dB
Single Supply Voltage (min)
3V
Single Supply Voltage (max)
18V
Dual Supply Voltage (min)
Not RequiredV
Dual Supply Voltage (max)
Not RequiredV
Mounting
Through Hole
Pin Count
8
Lead Free Status / Rohs Status
Compliant
Product specification
File under Integrated Circuits, IC01
DATA SHEET
TDA7052
1 W BTL mono audio amplifier
INTEGRATED CIRCUITS
July 1994

Related parts for TDA7052N2

Image
Part Number
Description
Manufacturer
Datasheet
Request R
LPC2420_60
Part Number:
LPC2420_60
Description:
NXP Semiconductors designed the LPC2420/2460 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
LPC2420_60.pdf (86 pages)
LPC2458
Part Number:
LPC2458
Description:
NXP Semiconductors designed the LPC2458 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
LPC2458.pdf (80 pages)
LPC2468
Part Number:
LPC2468
Description:
NXP Semiconductors designed the LPC2468 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
LPC2468.pdf (85 pages)
LPC2470
Part Number:
LPC2470
Description:
NXP Semiconductors designed the LPC2470 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
LPC2470.pdf (91 pages)
LPC2478
Part Number:
LPC2478
Description:
NXP Semiconductors designed the LPC2478 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
LPC2478.pdf (93 pages)
XA-G30
Part Number:
XA-G30
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
XA-G30.pdf (36 pages)
XA-G37
Part Number:
XA-G37
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
XA-G37.pdf (37 pages)
XA-S3
Part Number:
XA-S3
Description:
The XA-S3 device is a member of Philips Semiconductors? XA(eXtended Architecture) family of high performance 16-bitsingle-chip microcontrollers
Manufacturer:
NXP Semiconductors
Datasheet:
XA-S3.pdf (52 pages)
LH75401_LH75411_N
Part Number:
LH75401_LH75411_N
Description:
The NXP BlueStreak LH75401/LH75411 family consists of two low-cost 16/32-bit System-on-Chip (SoC) devices
Manufacturer:
NXP Semiconductors
Datasheet:
LH75401_LH75411_N.pdf (63 pages)
LPC3130_3131
Part Number:
LPC3130_3131
Description:
The NXP LPC3130/3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB2
Manufacturer:
NXP Semiconductors
Datasheet:
LPC3130_3131.pdf (68 pages)
LPC3141FET180
Part Number:
LPC3141FET180
Description:
The NXP LPC3141 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
LPC3143FET180
Part Number:
LPC3143FET180
Description:
The NXP LPC3143 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
LPC3152FET208
Part Number:
LPC3152FET208
Description:
The NXP LPC3152 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
LPC3154FET208
Part Number:
LPC3154FET208
Description:
The NXP LPC3154 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
BUK714R1-40BT
Part Number:
BUK714R1-40BT
Description:
Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using NXP High-Performance Automotive (HPA) TrenchMOS technology
Manufacturer:
NXP Semiconductors
Datasheet:
BUK714R1-40BT.pdf (13 pages)

TDA7052N2 Summary of contents

Page 1

DATA SHEET TDA7052 1 W BTL mono audio amplifier Product specification File under Integrated Circuits, IC01 INTEGRATED CIRCUITS July 1994 ...

Page 2

Philips Semiconductors 1 W BTL mono audio amplifier GENERAL DESCRIPTION The TDA7052 is a mono output amplifier in a 8-lead dual-in-line (DIL) plastic package. The device is designed for battery-fed portable audio applications. Features: No external components No switch-on or ...

Page 3

Philips Semiconductors 1 W BTL mono audio amplifier PINNING 1 V supply voltage input 3 GND1 ground (signal) 4 n.c. not connected July 1994 Fig.1 Block diagram. 5 OUT1 6 GND2 7 n.c. 8 OUT2 3 Product ...

Page 4

Philips Semiconductors 1 W BTL mono audio amplifier FUNCTIONAL DESCRIPTION The TDA7052 is a mono output amplifier designed for battery-fed portable audio applications, such as tape recorders and radios. The gain is fixed internally at 40 dB. A large number ...

Page 5

Philips Semiconductors 1 W BTL mono audio amplifier CHARACTERISTICS kHz amb SYMBOL PARAMETER Supply V Supply voltage range P I Total quiscent current tot G Voltage ...

Page 6

Philips Semiconductors 1 W BTL mono audio amplifier July 1994 Fig.3 Application diagram. 6 Product specification TDA7052 ...

Page 7

Philips Semiconductors 1 W BTL mono audio amplifier PACKAGE OUTLINE DIP8: plastic dual in-line package; 8 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions ...

Page 8

Philips Semiconductors 1 W BTL mono audio amplifier SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, ...

Related keywords