MT47H32M16BN-3:D Micron Technology Inc, MT47H32M16BN-3:D Datasheet - Page 31

• Manufacturer Part Number: MT47H32M16BN-3:D
• Manufacturer: Micron Technology Inc
• Type: DDR2 SDRAMr

Specifications of MT47H32M16BN-3:D

• Organization: 32Mx16
• Density: 512Mb
• Address Bus: 15b
• Access Time (max): 450ps
• Maximum Clock Rate: 667MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: FBGA
• Operating Temp Range: 0C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 250mA
• Pin Count: 84
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / Rohs Status: Compliant

Idd7 Conditions
Table 9: Idd7 Timing Patterns (4-Bank Interleave READ Operation)
PDF: 09005aef82f1e6e2
Rev. M 9/08 EN
Speed Grade
Timing patterns for 4-bank x4/x8/x16 devices
-5E
-37E
-3
-3E
-25
-25E
-187E
Idd7 Timing Patterns
A0 RA0 A1 RA1 A2 RA2 A3 RA3 D D D
A0 RA0 D A1 RA1 D A2 RA2 D A3 RA3 D D D D D
A0 RA0 D D A1 RA1 D D A2 RA2 D D A3 RA3 D D D D D D
A0 RA0 D D A1 RA1 D D A2 RA2 D D A3 RA3 D D D D D
A0 RA0 D D A1 RA1 D D A2 RA2 D D A3 RA3 D D D D D D D D D D
A0 RA0 D D A1 RA1 D D A2 RA2 D D A3 RA3 D D D D D D D D D
A0 RA0 D D D D A1 RA1 D D D D A2 RA2 D D D D A3 RA3 D D D D D D D D D D D
Notes:
The detailed timings are shown below for Idd7. Where general Idd parameters in Ta-
ble 8 (page 30) conflict with pattern requirements of Table 9 (page 31), then Table 9
(page 31) requirements take precedence.
1. A = active; RA = read auto precharge; D = deselect.
2. All banks are being interleaved at
3. Control and address bus inputs are stable during DESELECTs.
31
Electrical Specifications – Idd Parameters
t
RC (Idd) without violating
Micron Technology, Inc. reserves the right to change products or specifications without notice.
512Mb: x4, x8, x16 DDR2 SDRAM
© 2004 Micron Technology, Inc. All rights reserved.
t
RRD (Idd) using a BL = 4.