SLE 66R35 MFCC1 Infineon Technologies, SLE 66R35 MFCC1 Datasheet - Page 4

• Manufacturer Part Number: SLE 66R35 MFCC1
• Manufacturer: Infineon Technologies

Specifications of SLE 66R35 MFCC1

• Pin Count: 2
• Lead Free Status / Rohs Status: Compliant

1
Table 1
Type
SLE 66R35 C
SLE 66R35 NB
SLE 66R35 MFCC1
SLE 66R35 MCC2
SLE 66R35 MCC8
For more ordering information (wafer thickness and height of NiAu-Bump) please contact your local
Infineon sales office.
Pin Description
Figure 1
Figure 2
Figure 3
1)
2)
Short Product Information
Available as a Module Flip Chip Contactless (MFCC1), Module Contactless Card (MCC) for embedding in plastic
cards, as NiAu-bump version (NB) or as a die on sawn / unsawn wafer for customer packaging
FCoS™ Flip Chip on Substrate
Ordering and Packaging information
Pin Configuration Module Contactless Card MFCC1 (top / bottom view)
Pin Configuration Module Contactless Card MCC8 (top / bottom view)
Pin Configuration Module Contactless Card - MCC2 in (top view)
Ordering Information
Package
Die (on Wafer)
Die (on Wafer)
S-MFCC1-2-1
P-MCC2-2-1
P-MCC8-2-3
1)
4 / 7
Remark
sawn / unsawn
NiAu-Bump, sawn
FCoS™
2)
Ordering Code
on request
on request
on request
on request
on request
Mifare
SLE 66R35
2007-04-16
®
NRG