MT48H32M16LFCJ-75 Micron Technology Inc, MT48H32M16LFCJ-75 Datasheet - Page 45

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MT48H32M16LFCJ-75

Manufacturer Part Number
MT48H32M16LFCJ-75
Description
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet

Specifications of MT48H32M16LFCJ-75

Organization
32Mx16
Density
512Mb
Address Bus
15b
Access Time (max)
9/6ns
Maximum Clock Rate
133MHz
Operating Supply Voltage (typ)
1.8V
Package Type
VFBGA
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
1.95V
Operating Supply Voltage (min)
1.7V
Supply Current
90mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Compliant

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PDF: 09005aef81ca5de4/Source: 09005aef81ca5e03
MT48H32M16LF_1.fm - Rev. J 2/08 EN
10. Burst in bank n continues as initiated.
11. For a WRITE without auto precharge interrupted by a READ (with or without auto pre-
12. For a WRITE without auto precharge interrupted by a WRITE (with or without auto pre-
13. Concurrent auto precharge: Bank n will initiate the auto precharge command when its
14. For a READ with auto precharge interrupted by a READ (with or without auto precharge),
15. For a READ with auto precharge interrupted by a WRITE (with or without auto precharge),
16. For a WRITE with auto precharge interrupted by a READ (with or without auto precharge),
17. For a WRITE with auto precharge interrupted by a WRITE (with or without auto precharge),
5. A BURST TERMINATE command cannot be issued to another bank; it applies to the bank
6. All states and sequences not shown are illegal or reserved.
7. READs or WRITEs to bank m listed in the Command (Action) column include READs or
8. For a READ without auto precharge interrupted by a READ (with or without auto pre-
9. For a READ without auto precharge interrupted by a WRITE (with or without auto pre-
represented by the current state only.
WRITEs with auto precharge enabled and READs or WRITEs with auto precharge disabled.
charge), the READ to bank m will interrupt the READ on bank n, CL later (Figure 11 on
page 24).
charge), the WRITE to bank m will interrupt the READ on bank n when registered. DQM
should be used one clock prior to the WRITE command to prevent bus contention.
charge), the READ to bank m will interrupt the WRITE on bank n when registered, with the
data-out appearing CL later. The last valid WRITE to bank n will be data-in registered one
clock prior to the READ to bank m.
charge), the WRITE to bank will interrupt the WRITE on bank n when registered. The last
valid WRITE to bank n will be data-in registered one clock prior to the READ to bank m.
burst has been interrupted by bank m burst.
the READ to bank m will interrupt the READ on bank n, CL later. The PRECHARGE to bank n
will begin when the READ to bank m is registered.
the WRITE to bank m will interrupt the READ on bank n when registered. DQM should be
used two clocks prior to the WRITE command to prevent bus contention. The PRECHARGE
to bank n will begin when the WRITE to bank m is registered.
the READ to bank m will interrupt the WRITE on bank n when registered, with the data-out
appearing CL later. The PRECHARGE to bank n will begin after
begins when the READ to bank m is registered. The last valid WRITE bank n will be data-in
registered one clock prior to the READ to bank m.
the WRITE to bank m interrupt the WRITE on bank n when registered. The PRECHARGE to
bank n will begin after
tered. The last valid WRITE to bank n will be data registered one clock to the WRITE to
bank m.
512Mb: 32 Meg x 16, 16 Meg x 32 Mobile SDRAM
t
WR is met, where
45
Micron Technology, Inc., reserves the right to change products or specifications without notice.
t
WR begins when the WRITE to bank m is regis-
t
WR is met, where
©2005 Micron Technology, Inc. All rights reserved.
Truth Tables
t
WR

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