MT46V16M8P-75 Micron Technology Inc, MT46V16M8P-75 Datasheet - Page 23

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MT46V16M8P-75

Manufacturer Part Number
MT46V16M8P-75
Description
Manufacturer
Micron Technology Inc
Datasheet

Specifications of MT46V16M8P-75

Lead Free Status / Rohs Status
Compliant
Table 19:
PDF: 09005aef816fd013/Source: 09005aef82a95a3a
DDR_x4x8x16_Core2.fm - 128Mb DDR: Rev. F; Core DDR: Rev. A 4/07 EN
AC Characteristics
Parameter
DQS read postamble
ACTIVE bank a to ACTIVE bank b command
Terminating voltage delay to V
DQS write preamble
DQS write preamble setup time
DQS write postamble
Write recovery time
Internal WRITE-to-READ command delay
Exit SELF REFRESH-to-non-
READ command
Exit SELF REFRESH-to-READ command
Data valid output window (DVW)
Electrical Characteristics and Recommended AC Operating Conditions (-6, -6T, -75E)
(continued)
Notes: 1–6, 15–18, 34 apply to entire table; Notes appear on pages 26–32;
Notes:
1. -6 (FBGA) available in 256Mb and 512Mb densities only.
128Mb, 256Mb, 512Mb
1Gb
SS
Symbol
t
t
WPRES
t
t
t
t
t
WPRE
t
WPST
t
t
XSNR
XSNR
XSRD
RPST
t
WTR
RRD
VTD
n/a
WR
23
t
Min
-6 (FBGA)
0.25
QH -
200
0.4
0.4
12
15
75
0
0
1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
t
Electrical Specifications – DC and AC
DQSQ
Max
0.6
0.6
1
128Mb: x4, x8, x16 DDR SDRAM
t
Min
0.25
-6T (TSOP)
126
200
QH -
0.4
0.4
12
15
75
0
0
1
t
DQSQ
Max
0.6
0.6
t
Min
©2004 Micron Technology, Inc. All rights reserved.
0.25
QH -
200
0.4
0.4
15
15
75
0
0
1
-75E
t
DQSQ
Max
0.6
0.6
Units Notes
t
t
t
t
t
CK
ns
ns
CK
ns
CK
ns
CK
ns
ns
CK
ns
21, 22
44
20
26

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