TCD1304DG(Z,AW) Toshiba, TCD1304DG(Z,AW) Datasheet
TCD1304DG(Z,AW)
Specifications of TCD1304DG(Z,AW)
Related parts for TCD1304DG(Z,AW)
TCD1304DG(Z,AW) Summary of contents
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... TOSHIBA CCD LINEAR IMAGE SENSOR CCD(Charge Coupled Device) FEATURES MAXIMUM RATINGS (Note 1) CHARACTERISTIC Master Clock Pulse Voltage SH Pulse Voltage ICG Pulse Voltage Digital Power Supply Analog Power Supply Operating Temperature Storage Temperature Note: All voltage are with respect to SS terminals. (Ground) ...
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CIRCUIT DIAGRAM PIN NAMES M Master Clock φ SH Shift Gate ICG Integration Clear Gate V Power (Analog Power (Digital Ground NC Non Connection 2 TCD1304DG 2004-01-06 ...
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OPTICAL / ELECTRICAL CHARACTERISTICS (Ta = 25° 4.0V (PULSE), f φ RESISTANCE = 100k , V AD LAMP) CHARACTERISTIC Sensitivity Photo Response Non Uniformity Register Imbalance Saturation Output Voltage Dark Signal Voltage Total Transfer Effeiciency Dynamic Range ...
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V SAT Note 6: Definition MDK V is proportional to t MDK INT So the shorter t condition makes wider DR value. INT V SAT Note 7: Definition ...
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OPERATING CONDITION CHARACTERISTIC Master Clock Pulse Voltage SH Pulse Voltage ICG Pulse Voltage Digital Power Supply Analog Power Supply Note MAX. Voltage of Pulse Voltage “H” Level = V MIN. Voltage of Pulse Voltage “H” ...
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TIMING CHART TCD1304DG−6 ...
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TIMING CHART (Use electric shutter function) TCD1304DG−7 ...
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TIMING REQUIREMENTS CHARACTERISTIC ICG Pulse DELAY Pulse Timing of ICG and Pulse Width Pulse Timing of ICG and φ You keep M “High” Level. φ Note: If you use electronic shutter function. t SYMBOL t1 ...
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USE ELECTRONIC SHUTTER • t (MIN.) = 10µs INT You have always same SH pulse width (t3). 9 TCD1304DG 2004-01-06 ...
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TYPICAL PERFOMANCE CURVES 10 TCD1304DG 2004-01-06 ...
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TYPICAL PERFOMANCE CURVES 11 TCD1304DG 2004-01-06 ...
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TYPICAL DRIVE CIRCUIT TCD1304D TCD1304D TCD1304D TCD1304D 12 TCD1304DG 2004-01-06 ...
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CAUTION 1. Window Glass 2. Electrostatic Breakdown 3. Incident Light 4. Lead Frame Forming 5. Soldering 13 TCD1304DG 2004-01-06 ...
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PACKAGE DIMENSIONS Note 1: No. 1 SENSOR ELEMENT (S1) TO EDGE OF PACKAGE. Note 2: TOP OF CHIP TO BOTTOM OF PACKAGE. Note 3: GLASS THICKNES (n = 1.5) Weight: (3.5g (Typ.)) 14 TCD1304DG Unit : mm 2004-01-06 ...
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... TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property ...