LFE3-150EA-8FN1156C Lattice, LFE3-150EA-8FN1156C Datasheet
LFE3-150EA-8FN1156C
Manufacturer Part Number
LFE3-150EA-8FN1156C
Description
IC FPGA 149K LUTS 586I/O FN1156
Manufacturer
Lattice
Series
ECP3r
Datasheets
1.LFE3-150EA-7FN672C.pdf
(136 pages)
2.LFE3-35EA-8FN672I.pdf
(4 pages)
3.LFE3-35EA-8FN672I.pdf
(21 pages)
Specifications of LFE3-150EA-8FN1156C
Number Of Logic Elements/cells
149000
Number Of Labs/clbs
18625
Total Ram Bits
7014400
Number Of I /o
586
Number Of Gates
-
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
1156-BBGA
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
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Transcend
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1 000
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LFE3-150EA-8FN1156C
Manufacturer:
LATTICE
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Part Number:
LFE3-150EA-8FN1156CTW
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
LatticeECP3 Family
Build Leading Edge Systems with Proven
3rd Generation FPGAs
L O W - P O W E R S E R D E S , H I G H - S P E E D D D R 3 , H I G H - C A L I B E R D S P
LatticeECP3™ is the best-in-class mid-range FPGA with
high-performance SERDES, full-featured DSP blocks, and
support for state-of-the-art memory interfaces including
DDR3. It offers 35% to 100% more silicon resources in
smaller packages compared to competitors. Low-power
LatticeECP3 FPGAs are used in a wide-range of applica-
tions, such as wireless and wireline communication, video
processing, security and surveillance, industrial networking,
industrial automation, computing, storage, medical equip-
ment, and consumer.
LatticeECP3 offers up to 150K LUTs of logic capacity and 7
Mbits of memory for system integration, cascadable high-
performance DSP blocks for signal processing, high-speed
memory interfaces including DDR3 at 800 Mbps, and up
to 1 Gbps LVDS performance for ADC/DAC and SPI4.2 inter-
faces. LatticeECP3 further enables you to build high-speed
systems with proven 3.2 Gbps low-power SERDES qualified
for a number of protocols – PCI Express 1.1, Ethernet (GbE,
SGMII & XAUI), SMPTE SDI (3G/HD/SD), Serial RapidIO
2.1, low-latency CPRI, and JESD204A.
To accelerate design of LatticeECP3 powered systems, Lat-
tice also offers a number of generic and application-specific
development kits, an expanding portfolio of free readymade
reference designs, and a set of economical IP suites.
FPGA Fabric Features and Capabilities
Low-Power, High-Value FPGA Fabric
• Low-power 65nm process with 4-input look-up table
• Logic densities from 17K to 149K LUTs
• Up to 7Mbits of Embedded Block RAM (EBR) and
High-Speed Embedded SERDES
• Up to 16 channels with data rates from 150Mbps to
• Less than 110mW power per channel at 3.2Gbps
• Supports PCI Express, Ethernet (GbE, XAUI, SGMII),
Flexible sysIO™ Buffers
• LVCMOS 33/25/18/15/12, PCI
• SSTL 33/25/18/15 & HSTL15 & HSTL18
• LVDS, Bus-LVDS, RSDS, MLVDS & LVPECL
• 800Mbps DDR3
• Up to 1Gbps LVDS
Wide Range of Package & User I/O Options
• Up to 586 user I/O pins
• Proven low-cost wirebond fpBGA packages
• Density migration across all densities
• Pb-free / RoHS-compliant
sysCLOCK™ PLL and DLL
• 2 DLLs per device, 2 to 10 PLLs per device
(LUT) fabric
303Kbits of distributed RAM
3.2Gbps
SMPTE, Serial RapidIO 2.1, CPRI
www.latticesemi.com
LatticeECP3 Features and Benefits
CASCADABLE DSP WITH ALU
EMBEDDED SERDES
HIGH-SPEED I/O
ADVANCED CONFIGURATION OPTIONS
Fully cascadable slice for high performance filter
and wide arithmetic functions
Implement rounding and truncation functions
with 54-bit cascadable arithmetic logic unit
Multiply, accumulate, addition and subtraction
Up to 320 18x18 multipliers
3.2Gbps operation with less than 110mW power
Built-in pre-emphasis and equalization
Supports PCIe, Ethernet (GbE, XAUI, & SGMII),
Quad-based architecture with mix and match of
Single-channel granularity for 3G/HD/SD SDI
Support low latency variation CPRI links for
Pre-engineered DDR3 memory (800Mbps)
Up to 1Gbps LVDS
ADC/DAC, 7:1 LVDS, XGMII
Configure with SPI boot flash or parallel burst
Protect your designs with 128-bit AES
Dual-boot provides backup configuration copy
TransFR™ I/O support updates while system
per channel
SMPTE, Serial RapidIO, CPRI and JESD204A
different protocols within a quad
multi-hop RRH applications
mode flash
operates
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LFE3-150EA-8FN1156C Summary of contents
Page 1
... LatticeECP3 offers up to 150K LUTs of logic capacity and 7 Mbits of memory for system integration, cascadable high- performance DSP blocks for signal processing, high-speed memory interfaces including DDR3 at 800 Mbps, and Gbps LVDS performance for ADC/DAC and SPI4 ...
Page 2
... LatticeECP3 Architecture Architecture Overview LatticeECP3 FPGAs utilize Lattice’ s third generation of cost optimized transceiv- ers and a low-power 65-nm process FPGA architecture. Building on the successful LatticeECP2M™ FPGA fam- ily, LatticeECP3 devices deliver high- performance SERDES blocks, cascadable high-performance sysDSP™, ultra-high logic and sysMEM™ embedded RAM, ...
Page 3
... BOM. Features include Auto White Balance, industry's fastest auto-exposure, extremely low- latency and 120dB High Dynamic Range. The LatticeECP3 Serial Protocol Board provides a platform to evaluate the LatticeECP3 device's multi-protocol serial protocol functionality as well as DDR2 and DDR3 memory interfaces. The LatticeECP3 Video Protocol Board provides a platform to evaluate the LatticeECP3 device's multi-rate 3G/HD/SDI and 7:1 LVDS capabilities ...
Page 4
... Lattice Diamond, LatticeCORE, LatticeECP3, LatticeECP2M, LatticeMico32, sysCLOCK, sysCONFIG, sysDSP, sysIO, sysMEM, and TransFR are either registered trademarks or trademarks of Lattice Semiconductor Corporation in the United States and/or other countries. Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies. ...