CL10B222KB8NNNC SAMSUNG, CL10B222KB8NNNC Datasheet - Page 19
![no-image](/images/manufacturer_photos/0/5/577/samsung_sml.jpg)
CL10B222KB8NNNC
Manufacturer Part Number
CL10B222KB8NNNC
Description
MLCC 0603 X7R 2200PF 10% 50V
Manufacturer
SAMSUNG
Series
CLr
Specifications of CL10B222KB8NNNC
Size
0603
Dielectric
X7R
Tolerance
+/- 10%
Voltage
50V
Thickness
0.80
Electrode/termination/platin
Ni/Cu/Sn 100%
Products
Normal
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
CL10B222KB8NNNC
Manufacturer:
SamsungP
Quantity:
124 000
Company:
Part Number:
CL10B222KB8NNNC
Manufacturer:
SAMSUNG
Quantity:
8 000
▶ Manual Soldering
▶ Amount of Solder
▶ Bending Stress
the crack occur to the ready-installed MLCCs by the bending stress.
board. When the MLCCs are mounted onto the other side,
it is important to support the board as shown in the illustration. If the circuit board is not supported,
When double-sided circuit boards are used, MLCCs first are mounted and soldered onto one side of the
The hot soldering iron tip comes into direct contact with the end terminations, and operator's
carelessness may cause the tip of the soldering iron to come into direct contact with the ceramic
body of the capacitor.
Therefore the soldering iron must be handled carefully, and close attention must be paid
to the selection of the soldering iron tip and to temperature control of the tip.
Manual soldering can pose a great risk of creating thermal cracks in chip capacitors.
N ot eno ug h
Too m uc h
Goo d
S olde r
S olde r
nozzle
force
support pin
C rac k s tend to oc c ur due
to larg e s tres s
W eak hold ing forc e m ay
c aus e bad c onne c tions or
detac h ing of the c apac itor