CL10B222KB8NNNC SAMSUNG, CL10B222KB8NNNC Datasheet - Page 20
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CL10B222KB8NNNC
Manufacturer Part Number
CL10B222KB8NNNC
Description
MLCC 0603 X7R 2200PF 10% 50V
Manufacturer
SAMSUNG
Series
CLr
Specifications of CL10B222KB8NNNC
Size
0603
Dielectric
X7R
Tolerance
+/- 10%
Voltage
50V
Thickness
0.80
Electrode/termination/platin
Ni/Cu/Sn 100%
Products
Normal
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
CL10B222KB8NNNC
Manufacturer:
SamsungP
Quantity:
124 000
Company:
Part Number:
CL10B222KB8NNNC
Manufacturer:
SAMSUNG
Quantity:
8 000
▶ Cooling
Natural cooling using air is recommended. If the chips are dipped into solvent for cleaning, the
temperature difference(△T) must be less than 100℃
▶ Cleaning
If rosin flux is used, cleaning usually is unnecessary. When strongly activated flux is used, chlorine in
the flux may dissolve into some types of cleaning fluids, thereby affecting the chip capacitors. This
means that the cleaning fluid must be carefully selected, and should always be new.
▶ Notes for Separating Multiple, Shared PC Boards.
If the board is bent or distorted at the time of separation, cracks may occur in the chip capacitors.
Carefully choose a separation method that minimizes the bending often circuit board.
▶ Recommended Soldering Profile
A multi-PC board is separated into many individual circuit boards after soldering has been completed.
Soldering
Temp.(℃ )
200℃
150℃
Pre-heating
Reflow
260+0/-5℃
10sec.max.
Gradual cooling
in the air
Time(sec)