AD9786BSVRL Analog Devices Inc, AD9786BSVRL Datasheet - Page 8

• Manufacturer Part Number: AD9786BSVRL
• Description: IC DAC 16BIT INTERPOL/SP 80TQFP
• Manufacturer: Analog Devices Inc
• Series: TxDAC+®r

Specifications of AD9786BSVRL

• Number Of Bits: 16
• Data Interface: Parallel
• Number Of Converters: 1
• Voltage Supply Source: Single Supply
• Power Dissipation (max): 1.25W
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 80-TQFP Exposed Pad, 80-eTQFP, 80-HTQFP, 80-VQFP
• For Use With: AD9786-EB - BOARD EVALUATION FOR AD9786
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Settling Time: -

AD9786
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
AVDD1, AVDD2,
DRVDD
ACVDD, ADVDD,
CLKVDD, DVDD
AGND1, AGND2,
ACGND, ADGND,
CLKGND, DGND
REFIO, FSADJ
IOUTA, IOUTB
P1B15 to P1B0,
P2B15 to P2B0, RESET
DATACLK
CLK+, CLK−
CSB, SCLK,
SDIO, SDO
Junction
Storage
Lead Temperature
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate
on the human body and test equipment and can discharge without detection. Although this product
features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to
high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid
performance degradation or loss of functionality.
Temperature Range
Temperature
(10 sec)
AGND1
CLKGND
With Respect to
AGND1, AGND2,
ACGND, ADGND,
CLKGND, DGND
AGND1, AGND2,
ACGND, ADGND,
CLKGND, DGND
AGND1, AGND2,
ACGND, ADGND,
CLKGND, DGND
AGND1
DGND
DGND
DGND
Rating
−0.3 V to +3.6 V
−0.3 V to +2.8 V
−0.3 V to +0.3 V
−0.3 to AVDD1 + 0.3
−1.0 to AVDD1 +0.3
−0.3 to DRVDD + 0.3
−0.3 to DRVDD + 0.3
−0.3 to CLKVDD + 0.3
−0.3 to DRVDD + 0.3
−65°C to +125°C
150°C
300°C
Rev. B | Page 8 of 56
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
soldered in a circuit board for surface-mount packages.
Table 5. Thermal Resistance
Package Type
80-lead TQFP_EP (Thermally Enhanced)
`
1
θ
With thermal pad soldered to PCB.
JA
is specified for the worst-case conditions, that is, a device
1
θ
23.5
JA
Unit
°C/W