DSPB56374AE Freescale Semiconductor, DSPB56374AE Datasheet - Page 27

• Manufacturer Part Number: DSPB56374AE
• Description: IC DSP 24BIT 150MHZ 52-LQFP
• Manufacturer: Freescale Semiconductor
• Series: Symphony™r
• Type: Audio Processorr

Specifications of DSPB56374AE

• Interface: Host Interface, I²C, SAI, SPI
• Clock Rate: 150MHz
• Non-volatile Memory: ROM (84 kB)
• On-chip Ram: 54kB
• Voltage - I/o: 3.30V
• Voltage - Core: 1.25V
• Operating Temperature: -40°C ~ 110°C
• Mounting Type: Surface Mount
• Package / Case: 52-LQFP
• Product: DSPs
• Data Bus Width: 24 bit
• Processor Series: DSP563xx
• Core: 56000
• Numeric And Arithmetic Format: Fixed-Point
• Device Million Instructions Per Second: 150 MIPS
• Maximum Clock Frequency: 150 MHz
• Program Memory Type: Flash
• Program Memory Size: 24 KB
• Data Ram Size: 54 KB
• Operating Supply Voltage: 1.25 V or 3.3 V
• Maximum Operating Temperature: + 110 C
• Mounting Style: SMD/SMT
• Interface Type: SIA, SHI
• Minimum Operating Temperature: - 40 C
• Leaded Process Compatible: Yes
• Rohs Compliant: Yes
• Peak Reflow Compatible (260 C): Yes
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

To prevent a high current condition upon power up, the IO_VDD must be applied ahead of the Core_VDD
as shown below if the external Schottky is not used.
For correct operation of the internal power on reset logic, the Core_VDD ramp rate (Tr) to full supply must
be less than 10 ms. This is shown below.
7
Freescale Semiconductor
Natural Convection, Junction-to-ambient thermal
resistance
Junction-to-case thermal resistance
Note:
1
2
3
Thermal Characteristics
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance,
Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
Thermal resistance between the die and the case top surface as measured by the cold plate method
mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components
on the board, and board thermal resistance.
(MIL SPEC-883 Method 1012.1).
1,2
Core_VDD
Characteristic
Core_VDD
IO_VDD
Core_VDD
IO_VDD
Table 16. Thermal Characteristics
3
DSP56374 Data Sheet, Rev. 4.2
0 V
R
R
Symbol
θJC
θJA
or θ
or θ
Tr
JA
JC
Schottky
External
Diode
LQFP Values
68 (52 LQFP)
50 (80 LQFP)
17 (52 LQFP)
11 (80 LQFP)
1.25 V
Thermal Characteristics
°
°
Unit
C/W
C/W
27