EP2C70F896C8N Altera, EP2C70F896C8N Datasheet - Page 83
![IC CYCLONE II FPGA 70K 896-FBGA](/photos/6/72/67288/544-cyclone_ii_896-fbga_sml.jpg)
EP2C70F896C8N
Manufacturer Part Number
EP2C70F896C8N
Description
IC CYCLONE II FPGA 70K 896-FBGA
Manufacturer
Altera
Series
Cyclone® IIr
Datasheet
1.EP2C5T144C8N.pdf
(168 pages)
Specifications of EP2C70F896C8N
Number Of Logic Elements/cells
68416
Number Of Labs/clbs
4276
Total Ram Bits
1152000
Number Of I /o
622
Voltage - Supply
1.15 V ~ 1.25 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
896-FBGA
For Use With
P0304 - DE2-70 CALL FOR ACADEMIC PRICING544-1703 - VIDEO KIT W/CYCLONE II EP2C70N544-1699 - DSP KIT W/CYCLONE II EPS2C70N
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-
Other names
544-1695
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
EP2C70F896C8N
Manufacturer:
ALTERA
Quantity:
513
Introduction
Cyclone II
Hot-Socketing
Specifications
Altera Corporation
February 2007
CII51004-3.1
Cyclone
insertion, or hot swap) and power sequencing support without the use of
any external devices. You can insert or remove a Cyclone II board in a
system during system operation without causing undesirable effects to
the board or to the running system bus.
The hot-socketing feature lessens the board design difficulty when using
Cyclone II devices on printed circuit boards (PCBs) that also contain a
mixture of 3.3-, 2.5-, 1.8-, and 1.5-V devices. With the Cyclone II
hot-socketing feature, you no longer need to ensure a proper power-up
sequence for each device on the board.
The Cyclone II hot-socketing feature provides:
■
■
■
This chapter also discusses the power-on reset (POR) circuitry in
Cyclone II devices. The POR circuitry keeps the devices in the reset state
until the V
Cyclone II devices offer hot-socketing capability with all three features
listed above without any external components or special design
requirements. The hot-socketing feature in Cyclone II devices offers the
following:
■
■
Board or device insertion and removal without external components
or board manipulation
Support for any power-up sequence
Non-intrusive I/O buffers to system buses during hot insertion
The device can be driven before power-up without any damage to
the device itself.
I/O pins remain tri-stated during power-up. The device does not
drive out before or during power-up, thereby affecting other buses
in operation.
®
II devices offer hot socketing (also known as hot plug-in, hot
CC
is within operating range.
4. Hot Socketing & Power-On
Reset
4–1